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Material Type: Livro
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From 5G to 6G: Technologies, Architecture, AI, and Security
Yarali, Abdulrahman
Newark: Wiley 2023
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2
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Material Type: Ata de Congresso
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2022 IEEE Congress on Evolutionary Computation (CEC)
2022 IEEE Congress on Evolutionary Computation (CEC), 2022, p.2-2
IEEE
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3
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Material Type: Livro
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Computer Models of Process Dynamics: From Newton to Energy Fields
Rubin, Olis Harold
Newark: Wiley 2022
Sem texto completo
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4
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Material Type: Artigo
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Linguocognitive Conflict of Digital and Pre-Digital Thinking in Online Educational Discourse During the Pandemic: Social Danger or a New Challenge?
Karabulatova, Irina S. ; Aipova, Ainash K. ; Butt, Saad Masood ; Amiridou, Stefania
Journal of Siberian Federal University. Humanities & Social Sciences, 2021-10, Vol.14 (10), p.1517-1537
[Periódico revisado por pares]
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5
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Material Type: Livro
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The car that knew too much: can a machine be moral?
Bonnefon, Jean-François
The MIT Press 2021
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6
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Material Type: Artigo
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Vibration Measurement of a Rotating Shaft using Electrostatic Sensor
Jamal, Muhammad R A A ; Rasheed, Khaled S Al
International journal of recent technology and engineering, 2021-09, Vol.10 (3), p.97-105
Sem texto completo
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7
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Material Type: Livro
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Running with Robots: The American High School's Third Century
Toppo, Greg ; Tracy, Jim
MIT Press, 2021
MIT Press
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8
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Material Type: Ata de Congresso
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International Conference on Cyberworlds, CW 2021. Proceedings: 28-30 September 2021, Caen, France
Sourin, Alexei ; Rosenberger, Christophe ; Sourina, Olga
IEEE Computer Society Conference Publishing Services (CPS), Los Alamitos, Calif 2021
Sem texto completo
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9
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Material Type: Livro
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Electromagnetic Radiation, Scattering, and Diffraction
Pathak, Prabhakar H ; Burkholder, Robert J
Newark: Wiley 2021
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10
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Material Type: Artigo
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Accuracy of Detection and Classification of DC Faults using Levenberg Marquardt Based Back Propagation Algorithm
Kumar, Dr. Sujit ; Kamal, Dr. Neel ; Power, Dr. Pankaj Kumar ; Gaur, Mr. Aditya ; Tiwari, Mr. Vikash
International journal of innovative technology and exploring engineering, 2020-04, Vol.9 (6), p.289-294
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