Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
---|---|---|---|
1 |
Material Type: Artigo
|
Das Durchsetzungsregime im Digital Markets Act: Private Enforcement unerwünscht?Achleitner, Ranjana AndreaZeitschrift für öffentliches Recht (Vienna, Austria : 1996), 2023-06, Vol.78 (2), p.287-300 [Periódico revisado por pares]Verlag ÖsterreichTexto completo disponível |
|
2 |
Material Type: Capítulo de Livro
|
Confessing the Faith: Reasoning in TraditionAdams, Nicholas Wells, Samuel ; Hauerwas, StanleyThe Blackwell Companion to Christian Ethics, 2011, p.224-236Oxford, UK: Wiley‐BlackwellTexto completo disponível |
|
3 |
Material Type: Artigo
|
Experimental characterisation of coaxial TSV transistor keep out zonesAdamshick, Stephen ; Northrup, Steven ; Liehr, MichaelMicro & nano letters, 2018-10, Vol.13 (10), p.1457-1459 [Periódico revisado por pares]Stevenage: The Institution of Engineering and TechnologyTexto completo disponível |
|
4 |
Material Type: Artigo
|
Sexuality in Nigerian Pregnant Women: Perceptions and PracticeAdinma, J. I. B.Australian & New Zealand journal of obstetrics & gynaecology, 1995-08, Vol.35 (3), p.290-293 [Periódico revisado por pares]Oxford, UK: Blackwell Publishing LtdSem texto completo |
|
5 |
Material Type: Artigo
|
Navigating the nexus of MRD and novel agents in ALLAdvani, Anjali S ; Copelan, Edward AHematology, 2019-12, Vol.2019 (1), p.9-16United States: American Society of HematologyTexto completo disponível |
|
6 |
Material Type: Artigo
|
Principles of Affective Design in Consumers’ Response to Sustainability Design StrategiesAgost, Maria-Jesus ; Vergara, MargaritaSustainability (Basel, Switzerland), 2020-12, Vol.12 (24), p.10573 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |
|
7 |
Material Type: Ata de Congresso
|
3D floorplanning with nets-to-TSVs assignmentAhmed, M. A. ; Mohapatra, S. ; Chrzanowska-Jeske, M.2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2014, p.578-581IEEESem texto completo |
|
8 |
Material Type: Ata de Congresso
|
TSVs in early layout design exploration for 3D ICsAhmed, Mohammad A. ; Chrzanowska-Jeske, M.2014 IEEE 5th Latin American Symposium on Circuits and Systems, 2014, p.1-4IEEESem texto completo |
|
9 |
Material Type: Artigo
|
TSV- and delay-aware 3D-IC floorplanningAhmed, Mohammad A. ; Mohapatra, S. ; Chrzanowska-Jeske, M.Analog integrated circuits and signal processing, 2016-05, Vol.87 (2), p.235-248 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
|
10 |
Material Type: Artigo
|
Remarks by Usman AhmedAhmed, UsmanProceedings of the annual meeting - American Society of International Law, 2014, Vol.108, p.348-349New York, USA: Cambridge University PressTexto completo disponível |