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Non-destructive Evaluation of the Interface Between Silicon Dies and Copper Leadframes in Integrated Circuit Packaging
Non-destructive Evaluation of the Interface Between Silicon Dies and Copper Leadframes in Integrated Circuit Packaging
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Non-destructive Evaluation of the Interface Between Silicon Dies and Copper Leadframes in Integrated Circuit Packaging

Abdul, J ; Guo, N ; Du, H. ; Wong, B S ; Chan, K C

Experimental mechanics, 2004-04, Vol.44 (2), p.113-120 [Periódico revisado por pares]

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2
Recent advances and perspectives on starch nanocomposites for packaging applications
Recent advances and perspectives on starch nanocomposites for packaging applications
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Recent advances and perspectives on starch nanocomposites for packaging applications

Abdullah, Zainab Waheed ; Dong, Yu

Journal of materials science, 2018-11, Vol.53 (22), p.15319-15339 [Periódico revisado por pares]

New York: Springer US

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3
The European paper packaging market is rallying in 2010. Is this sustainable?
The European paper packaging market is rallying in 2010. Is this sustainable?
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The European paper packaging market is rallying in 2010. Is this sustainable?

Abidov, Orifjon

PPI, 2010-07, Vol.52 (7), p.48

San Francisco: RISI, Inc

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4
Feedback
Feedback
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magazinearticle 		Adicionar ao Meu Espaço

Feedback

Abrahams, Marc

New scientist (1971), 2024-02, Vol.261 (3478), p.48-48

London: New Scientist

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5
Packaging philosophy
Packaging philosophy
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magazinearticle 		Adicionar ao Meu Espaço

Packaging philosophy

Abrahams, Marc

New scientist (1971), 2023-05, Vol.258 (3440), p.56

New Scientist

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6
Comparison of Spatial Structures and Packaging of Phosphorybosil Pyrophosphate Synthetase 2 from Thermus thermophilus HB27 in Rhombohedral and Tetragonal Crystals
Comparison of Spatial Structures and Packaging of Phosphorybosil Pyrophosphate Synthetase 2 from Thermus thermophilus HB27 in Rhombohedral and Tetragonal Crystals
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Comparison of Spatial Structures and Packaging of Phosphorybosil Pyrophosphate Synthetase 2 from Thermus thermophilus HB27 in Rhombohedral and Tetragonal Crystals

Abramchik, Yulia ; Zayats, Evgeniy ; Kostromina, Maria ; Lykoshin, Dmitry ; Fateev, Ilya ; Konstantinova, Irina ; Zhukhlistova, Nadezda ; Timofeev, Vladimir ; Kuranova, Inna ; Esipov, Roman

Crystals (Basel), 2021-09, Vol.11 (9), p.1128 [Periódico revisado por pares]

Basel: MDPI AG

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7
Metal closures for PET containers
Metal closures for PET containers
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magazinearticle 		Adicionar ao Meu Espaço

Metal closures for PET containers

Abramowicz, Daniel

Food Engineering, 2017-03, Vol.89 (3), p.24

Troy: BNP Media

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8
Preparation and characterization of polyaniline/sodium alginate-doped TiO2 nanoparticles with promising mechanical and electrical properties and antimicrobial activity for food packaging applications
Preparation and characterization of polyaniline/sodium alginate-doped TiO2 nanoparticles with promising mechanical and electrical properties and antimicrobial activity for food packaging applications
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Preparation and characterization of polyaniline/sodium alginate-doped TiO2 nanoparticles with promising mechanical and electrical properties and antimicrobial activity for food packaging applications

Abutalib, M. M. ; Rajeh, A.

Journal of materials science. Materials in electronics, 2020-06, Vol.31 (12), p.9430-9442 [Periódico revisado por pares]

New York: Springer US

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9
How to choose a third-party logistics provider
How to choose a third-party logistics provider
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How to choose a third-party logistics provider

Ackerman, Ken

Material Handling Management, 2000-03, Vol.55 (3), p.95-100

Cleveland: Endeavor Business Media

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10
3rd International Workshop on Release Engineering (RELENG 2015)
3rd International Workshop on Release Engineering (RELENG 2015)
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Ata de Congresso 		Adicionar ao Meu Espaço

3rd International Workshop on Release Engineering (RELENG 2015)

Adams, Bram ; Bellomo, Stephany ; Bird, Christian ; Khomh, Foutse ; Moir, Kim

2015 IEEE/ACM 37th IEEE International Conference on Software Engineering, 2015, Vol.2, p.995-996

IEEE

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