Idioma:

Low Density Wood Particleboards Bonded with Starch Foam-Study of Production Process Conditions

Monteiro, Sandra ; Martins, Jorge ; Magalhães, Fernão D ; Carvalho, Luísa

Materials, 2019-06, Vol.12 (12), p.1975 [Periódico revisado por pares]

Switzerland: MDPI AG

Texto completo disponível

Citações Citado por

Enviar para

Título:
Low Density Wood Particleboards Bonded with Starch Foam-Study of Production Process Conditions
Autor: Monteiro, Sandra ; Martins, Jorge ; Magalhães, Fernão D ; Carvalho, Luísa
Assuntos: Adhesives ; Biodegradable materials ; Bond strength ; Bonding strength ; Cassava ; Cycle time ; Density ; Engineering ; Experiments ; foam ; Glycerol ; Laboratories ; lightweight ; Lignin ; Mechanical properties ; Moisture content ; Panels ; Parameters ; particleboard ; Pressing ; pressing parameters ; pressing process ; sour cassava starch ; Thickness ; Viscosity
É parte de: Materials, 2019-06, Vol.12 (12), p.1975
Notas: ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
Descrição: It has been shown that wood particleboards bonded with sour cassava starch can display low density combined with good physico-mechanical performance, thanks to starch being able to produce a strong foam that fills the interparticular space. Here we optimize the pressing conditions for the production of these panels. The procedure involved hot-plate pressing in two stages: (1) lowering the top platen to a specified thickness for a duration designated as pressing time, followed by (2) raising the top platen to allow panel expansion for a duration designated as hold time. The parameters studied were the pressing time (10 to 150 s), the hold time (290 to 890 s), and the top platen temperature (80 to 190 °C). The hold time and pressing time showed to be crucial parameters. The best operating conditions corresponded to 600 s of press cycle time, comprising 60 s of pressing time and 540 s of hold time. The top platen temperature used was 190 °C. The particleboards produced had a density of 405 kg·m , an internal bond strength of 0.44 N·mm , and a thickness swelling of 13.2%. This can be considered as very good performance, taking into account the panels' low density.
Editor: Switzerland: MDPI AG
Idioma: Inglês

Links

View this record in MEDLINE/PubMed

Voltar para lista de resultados

Realização: Logos de Redes Sociais:

Low Density Wood Particleboards Bonded with Starch Foam-Study of Production Process Conditions

Monteiro, Sandra ; Martins, Jorge ; Magalhães, Fernão D ; Carvalho, Luísa

Switzerland: MDPI AG

Buscando em bases de dados remotas. Favor aguardar.