CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications

CHANG, T. C ; TSAI, T. M ; LIU, P. T ; CHEN, C. W ; YAN, S. T ; AOKI, H ; CHANGE, Y. C ; TSENG, T. Y

Thin solid films, 2004, Vol.447-48, p.524-530 [Periódico revisado por pares]

Lausanne: Elsevier Science

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