Copper surface protection with a completely enclosed copper structure for a damascene process

WANG, T. C ; HSIEH, T. E ; WANG, Y. L ; WU, Y. L ; LO, K. Y ; LIU, C. W ; CHEN, K. W

Thin solid films, 2004, Vol.447-48, p.542-548 [Periódico revisado por pares]

Lausanne: Elsevier Science

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