Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate

Balachandran, R. ; Yow, H.K. ; Ong, B.H. ; Manickam, R. ; Saaminathan, V. ; Tan, K.B.

Journal of alloys and compounds, 2009-07, Vol.481 (1), p.336-339 [Periódico revisado por pares]

Kidlington: Elsevier B.V

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