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Refinado por: Nome da Publicação: IEEE Transactions on Biomedical Engineering remover Base de dados/Biblioteca: Engineered Materials Abstracts remover
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1
Statistical accuracy of a moving equivalent dipole method to identify sites of origin of cardiac electrical activation
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Statistical accuracy of a moving equivalent dipole method to identify sites of origin of cardiac electrical activation

Armoundas, A.A. ; Feldman, A.B. ; Mukkamala, R. ; Bin He ; Mullen, T.J. ; Belk, P.A. ; Lee, Y.Z. ; Cohen, R.J.

IEEE transactions on biomedical engineering, 2003-12, Vol.50 (12), p.1360-1370 [Periódico revisado por pares]

New York, NY: IEEE

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2
Estimation of the cortical connectivity by high-resolution EEG and structural equation modeling: Simulations and application to finger tapping data
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Estimation of the cortical connectivity by high-resolution EEG and structural equation modeling: Simulations and application to finger tapping data

Astolfi, L. ; Dayan, D.B. ; Lei Ding ; Ying Ni ; Bin He ; Babiloni, F. ; Cincotti, F. ; Babiloni, C. ; Carducci, F. ; Basilisco, A. ; Rossini, P.M. ; Salinari, S. ; Mattia, D. ; Cerutti, S.

IEEE transactions on biomedical engineering, 2005-05, Vol.52 (5), p.757-768 [Periódico revisado por pares]

United States: IEEE

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3
Estimation of Number of Independent Brain Electric Sources From the Scalp EEGs
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Estimation of Number of Independent Brain Electric Sources From the Scalp EEGs

Bai, X. ; He, B.

IEEE transactions on biomedical engineering, 2006-10, Vol.53 (10), p.1883-1892 [Periódico revisado por pares]

United States: IEEE

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4
An equivalent current source model and Laplacian weighted minimum norm current estimates of brain electrical activity
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An equivalent current source model and Laplacian weighted minimum norm current estimates of brain electrical activity

Bin He ; Yao, D. ; Lian, J. ; Wu, D.

IEEE transactions on biomedical engineering, 2002-04, Vol.49 (4), p.277-288 [Periódico revisado por pares]

New York, NY: IEEE

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5
Three-dimensional myocardial activation imaging in a rabbit model
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Three-dimensional myocardial activation imaging in a rabbit model

Chenguang Liu ; Xin Zhang ; Zhongming Liu ; Pogwizd, S.M. ; Bin He

IEEE transactions on biomedical engineering, 2006-09, Vol.53 (9), p.1813-1820 [Periódico revisado por pares]

United States: IEEE

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6
Spatio-temporal EEG source localization using a three-dimensional subspace FINE approach in a realistic geometry inhomogeneous head model
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Spatio-temporal EEG source localization using a three-dimensional subspace FINE approach in a realistic geometry inhomogeneous head model

Ding, Lei ; He, Bin

IEEE transactions on biomedical engineering, 2006-09, Vol.53 (9), p.1732-1739 [Periódico revisado por pares]

United States: IEEE

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7
Three-Dimensional Imaging of Complex Neural Activation in Humans From EEG
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Three-Dimensional Imaging of Complex Neural Activation in Humans From EEG

Ding, Lei ; Zhang, Nanyin ; Chen, Wei ; He, Bin

IEEE transactions on biomedical engineering, 2009-08, Vol.56 (8), p.1980-1988 [Periódico revisado por pares]

United States: IEEE

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8
Noninvasive Imaging of Bioimpedance Distribution by Means of Current Reconstruction Magnetic Resonance Electrical Impedance Tomography
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Noninvasive Imaging of Bioimpedance Distribution by Means of Current Reconstruction Magnetic Resonance Electrical Impedance Tomography

Gao, Nuo ; He, Bin

IEEE transactions on biomedical engineering, 2008-05, Vol.55 (5), p.1530-1538 [Periódico revisado por pares]

United States: IEEE

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9
Noninvasive localization of the site of origin of paced cardiac activation in human by means of a 3-D heart model
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Noninvasive localization of the site of origin of paced cardiac activation in human by means of a 3-D heart model

Guanglin Li ; Xin Zhang ; Jie Lian ; He, B.

IEEE transactions on biomedical engineering, 2003-09, Vol.50 (9), p.1117-1120 [Periódico revisado por pares]

New York, NY: IEEE

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10
TBME: A Retrospective
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TBME: A Retrospective

He, B.

IEEE transactions on biomedical engineering, 2018-12, Vol.65 (12), p.2673-2674 [Periódico revisado por pares]

New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)

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