Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Ata de Congresso
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First demonstration of W-band Tri-gate GaN-HEMT power amplifier MMIC with 30 dBm output powerTure, E. ; Bruckner, P. ; Alsharef, M. ; Granzner, R. ; Schwierz, F. ; Quay, R. ; Ambacher, O.2017 IEEE MTT-S International Microwave Symposium (IMS), 2017, p.35-37IEEESem texto completo |
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2 |
Material Type: Ata de Congresso
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Performance and parasitic analysis of sub-micron scaled tri-gate AlGaN/GaN HEMT designTure, E. ; Bruckner, P. ; Raay, F. V. ; Quay, R. ; Ambacher, O. ; Alsharef, M. ; Granzner, R. ; Schwierz, F.2015 10th European Microwave Integrated Circuits Conference (EuMIC), 2015, p.97-100EuMASem texto completo |
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3 |
Material Type: Ata de Congresso
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Enhancement-mode AlGaN/GaN FinFETs with high on/off performance in 100 nm gate lengthTure, E. ; Bruckner, P. ; Quay, R. ; Ambacher, O. ; Alsharef, M. ; Granzner, R. ; Schwierz, F.2016 11th European Microwave Integrated Circuits Conference (EuMIC), 2016, p.61-64European Microwave AssociationTexto completo disponível |
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4 |
Material Type: Ata de Congresso
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Enhancement-mode AlGaN/GaN FinFETs with high on/off performance in 100 nm gate lengthTure, E ; Brueckner, P ; Quay, R ; Ambacher, O ; Alsharef, M ; Granzner, R ; Schwierz, F2016Sem texto completo |
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5 |
Material Type: Ata de Congresso
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Performance of tri-gate AlGaN/GaN HEMTsAlsharef, M ; Granzner, R ; Schwierz, F ; Ture, E ; Quay, R ; Ambacher, O2016Sem texto completo |
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6 |
Material Type: Ata de Congresso
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Performance and parasitic analysis of sub-micron scaled tri-gate AlGaN/GaN HEMT designTure, E ; Brückner, P ; Raay, F. van ; Quay, R ; Ambacher, O ; Alsharef, M ; Granzner, R ; Schwierz, F2015Sem texto completo |
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7 |
Material Type: Ata de Congresso
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The impact of changed barrier layer parameters upon tunnelling in GaN/AlGaN/GaN Schottky structuresRacko, J. ; Mikolasek, M. ; Granzner, R. ; Al Mustafa, N. ; Schwierz, F. ; Breza, J.The Ninth International Conference on Advanced Semiconductor Devices and Mircosystems, 2012, p.207-210IEEETexto completo disponível |