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1
Modeling of air bubble dynamics during resin transfer molding by pore doublet model
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Modeling of air bubble dynamics during resin transfer molding by pore doublet model

Aaboud, Bouchra ; Saouab, Abdelghani ; Park, Chung Hae

International journal of advanced manufacturing technology, 2019-12, Vol.105 (5-6), p.2343-2355 [Periódico revisado por pares]

London: Springer London

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2
Efficient Pump Photon Recycling via Gain-Assisted Waveguiding Energy Transfer
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Efficient Pump Photon Recycling via Gain-Assisted Waveguiding Energy Transfer

Aad, Roy ; Couteau, Christophe ; Blaize, Sylvain ; Chastaing, Evelyne ; Soyer, Françoise ; Divay, Laurent ; Galindo, Christophe ; Le Barny, Pierre ; Sallet, Vincent ; Sartel, Corinne ; Lusson, Alain ; Galtier, Pierre ; Rocha, Licinio ; Simic, Vesna ; Lérondel, Gilles

ACS photonics, 2014-03, Vol.1 (3), p.246-253

American Chemical Society

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3
Comparative study of soft thermal printing and lamination of dry thick photoresist films for the uniform fabrication of polymer MOEMS on small-sized samples
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Comparative study of soft thermal printing and lamination of dry thick photoresist films for the uniform fabrication of polymer MOEMS on small-sized samples

Abada, S ; Salvi, L ; Courson, R ; Daran, E ; Reig, B ; Doucet, J B ; Camps, T ; Bardinal, V

Journal of micromechanics and microengineering, 2017-05, Vol.27 (5), p.55018 [Periódico revisado por pares]

IOP Publishing

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4
Texture and Stress Evolution in HfN Films Sputter-Deposited at Oblique Angles
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Texture and Stress Evolution in HfN Films Sputter-Deposited at Oblique Angles

Abadias, Grégory ; Anğay, Fırat ; Mareus, Rubenson ; Mastail, Cédric

Coatings (Basel), 2019-11, Vol.9 (11), p.712 [Periódico revisado por pares]

Basel: MDPI AG

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5
Large influence of vacancies on the elastic constants of cubic epitaxial tantalum nitride layers grown by reactive magnetron sputtering
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Large influence of vacancies on the elastic constants of cubic epitaxial tantalum nitride layers grown by reactive magnetron sputtering

Abadias, Grégory ; Li, Chen-Hui ; Belliard, Laurent ; Hu, Qing Miao ; Greneche, Nicolas ; Djemia, Philippe

Acta materialia, 2020-02, Vol.184, p.254-266 [Periódico revisado por pares]

Elsevier Ltd

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6
Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers
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Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers

Abadie, K. ; Montméat, P. ; Enot, T. ; Fournel, F. ; Wimplinger, M.

International journal of adhesion and adhesives, 2019-06, Vol.91, p.123-130 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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7
Moisture performance of building materials: From material characterization to building simulation using the Moisture Buffer Value concept
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Moisture performance of building materials: From material characterization to building simulation using the Moisture Buffer Value concept

Abadie, Marc Olivier ; Mendonça, Kátia Cordeiro

Building and environment, 2009-02, Vol.44 (2), p.388-401 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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8
Contribution to analytical and numerical study of combined heat and moisture transfers in porous building materials
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Contribution to analytical and numerical study of combined heat and moisture transfers in porous building materials

Abahri, K. ; Belarbi, R. ; Trabelsi, A.

Building and environment, 2011-07, Vol.46 (7), p.1354-1360 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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9
Adaptive Helmholtz resonator based on electroactive polymers: modeling, characterization, and control
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Adaptive Helmholtz resonator based on electroactive polymers: modeling, characterization, and control

Abbad, Ahmed ; Rabenorosoa, Kanty ; Ouisse, Morvan ; Atalla, Noureddine

Smart materials and structures, 2018-10, Vol.27 (10), p.105029 [Periódico revisado por pares]

IOP Publishing

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10
Capillary microchannel fabrication using plasma polymerized TMDS for fluidic MEMS technology
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Capillary microchannel fabrication using plasma polymerized TMDS for fluidic MEMS technology

Abbas, A ; Supiot, P ; Mille, V ; Guillochon, D ; Bocquet, B

Journal of micromechanics and microengineering, 2009-04, Vol.19 (4), p.045022-045022 (8) [Periódico revisado por pares]

Bristol: IOP Publishing

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