Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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Material Type: Artigo
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Global Ocean Altimetry With GNSS Reflections From TechDemoSat-1Mashburn, Jake ; Axelrad, Penina ; Lowe, Stephen T. ; Larson, Kristine M.IEEE transactions on geoscience and remote sensing, 2018-07, Vol.56 (7), p.4088-4097 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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2 |
Material Type: Artigo
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Validation of Sea-Ice Topographic Heights Derived From TanDEM-X Interferometric SAR Data With Results From Laser Profiler and PhotogrammetryYitayew, Temesgen Gebrie ; Dierking, Wolfgang ; Divine, Dmitry V. ; Eltoft, Torbjorn ; Ferro-Famil, Laurent ; Rosel, Anja ; Negrel, JeanIEEE transactions on geoscience and remote sensing, 2018-11, Vol.56 (11), p.6504-6520 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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3 |
Material Type: Artigo
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Refraction Correction of Airborne LiDAR Bathymetry Based on Sea Surface Profile and Ray TracingYang, Fanlin ; Su, Dianpeng ; Ma, Yue ; Feng, Chengkai ; Yang, Anxiu ; Wang, MingweiIEEE transactions on geoscience and remote sensing, 2017-11, Vol.55 (11), p.6141-6149 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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4 |
Material Type: Artigo
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An Interferometric Approach to Cross-Track Clutter Detection in Two-Channel VHF Radar SoundersCastelletti, Davide ; Schroeder, Dustin M. ; Hensley, Scott ; Grima, Cyril ; Ng, Gregory ; Duncan Young ; Yonggyu Gim ; Bruzzone, Lorenzo ; Moussessian, Alina ; Blankenship, Don D.IEEE transactions on geoscience and remote sensing, 2017-11, Vol.55 (11), p.6128-6140 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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5 |
Material Type: Artigo
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Modelling and analysis of generation mechanism of micro-surface topography during elliptical ultrasonic assisted grindingWang, Qiuyan ; Liang, Zhiqiang ; Wang, Xibin ; Bai, Shuowei ; Yeo, Swee Hock ; Jia, ShunJournal of materials processing technology, 2020-05, Vol.279, p.116585, Article 116585 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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6 |
Material Type: Artigo
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Effect of the progressive tool wear on surface topography and chip formation in micro-milling of Ti–6Al–4V using Ti(C7N3)-based cermet micro-millWang, Yishun ; Zou, Bin ; Wang, Juncheng ; Wu, You ; Huang, ChuanzhenTribology international, 2020-01, Vol.141, p.105900, Article 105900 [Periódico revisado por pares]Kidlington: Elsevier LtdTexto completo disponível |
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7 |
Material Type: Artigo
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Modeling Anisotropic Reflectance Over Composite Sloping TerrainHao, Dalei ; Wen, Jianguang ; Xiao, Qing ; Wu, Shengbiao ; Lin, Xingwen ; You, Dongqin ; Tang, YongIEEE transactions on geoscience and remote sensing, 2018-07, Vol.56 (7), p.3903-3923 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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8 |
Material Type: Artigo
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Footprint Size Design of Large-Footprint Full-Waveform LiDAR for Forest and Topography Applications: A Theoretical StudyYang, Xuebo ; Wang, Cheng ; Xi, Xiaohuan ; Wang, Yingjie ; Zhang, Ying ; Zhou, GuoqingIEEE transactions on geoscience and remote sensing, 2021-11, Vol.59 (11), p.9745-9757 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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9 |
Material Type: Artigo
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Temporal Extrapolation of Daily Downward Shortwave Radiation Over Cloud-Free Rugged Terrains. Part 1: Analysis of Topographic EffectsYan, Guangjian ; Tong, Yiyi ; Yan, Kai ; Mu, Xihan ; Chu, Qing ; Zhou, Yingji ; Liu, Yanan ; Qi, Jianbo ; Li, Linyuan ; Zeng, Yelu ; Zhou, Hongmin ; Xie, Donghui ; Zhang, WumingIEEE transactions on geoscience and remote sensing, 2018-11, Vol.56 (11), p.6375-6394 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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10 |
Material Type: Artigo
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Real-Time Removal of Topographic Artifacts in Scanning Microwave MicroscopyFabi, Gianluca ; Joseph, C. H. ; Pavoni, Eleonora ; Wang, Xiaopeng ; Hadi, Richard Al ; Hwang, James C. M. ; Morini, Antonio ; Farina, MarcoIEEE transactions on microwave theory and techniques, 2021-05, Vol.69 (5), p.2662-2672 [Periódico revisado por pares]New York: IEEETexto completo disponível |