Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Interfacial Microstructure Evolution and Shear Behavior of Au-Sn/Ni-xCu Joints at 350°CPeng, J. ; Wang, R. C. ; Wang, M. ; Liu, H. S.Journal of electronic materials, 2017-04, Vol.46 (4), p.2021-2029 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
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2 |
Material Type: Artigo
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Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn systemLIU, X. J ; LIU, H. S ; OHNUMA, I ; KAINUMA, R ; ISHIDA, K ; ITABASHI, S ; KAMEDA, K ; YAMAGUCHI, KJournal of electronic materials, 2001-09, Vol.30 (9), p.1093-1103 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
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3 |
Material Type: Artigo
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Thermodynamic modeling of the Au-In-Sn systemLIU, H. S ; LIU, C. L ; ISHIDA, K ; JIN, Z. PJournal of electronic materials, 2003-11, Vol.32 (11), p.1290-1296 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
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4 |
Material Type: Artigo
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Interfacial reaction between Sn-Bi alloy and Ni substrateWANG, J ; LIU, H. S ; LIU, L. B ; JIN, Z. PJournal of electronic materials, 2006-10, Vol.35 (10), p.1842-1847 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
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5 |
Material Type: Artigo
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Thermodynamic Assessment of the Au-Co-Sn Ternary SystemDong, H. Q. ; Jin, S. ; Zhang, L. G. ; Wang, J. S. ; Tao, X. M. ; Liu, H. S. ; Jin, Z. P.Journal of electronic materials, 2009-10, Vol.38 (10), p.2158-2169 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
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6 |
Material Type: Artigo
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Thermodynamic modeling of the Au-Bi-Sb ternary systemWANG, J ; MENG, F. G ; LIU, H. S ; LIU, L. B ; JIN, Z. PJournal of electronic materials, 2007-05, Vol.36 (5), p.568-577 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
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7 |
Material Type: Artigo
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Thermodynamic modeling of the Au-In-Sb ternary systemLIU, H. S ; LIU, C. L ; WANG, C ; JIN, Z. P ; ISHIDA, KJournal of electronic materials, 2003-02, Vol.32 (2), p.81-88 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
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8 |
Material Type: Artigo
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Deep levels, electrical and optical characteristics in SnTe-doped GaSb Schottky diodesCHEN, J. F ; CHEN, N. C ; LIU, H. SJournal of electronic materials, 1996-11, Vol.25 (11), p.1790-1796 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
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9 |
Material Type: Artigo
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The properties of photo chemical-vapor deposition SiO2 and its application in GaN metal-insulator semiconductor ultraviolet photodetectorsCHIOU, Yu-Zung ; SU, Yan-Kuin ; CHANG, Shoou-Jinn ; JENG GONG ; CHANG, Chia-Sheng ; LIU, Sen-HaiJournal of electronic materials, 2003-05, Vol.32 (5), p.395-399 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
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10 |
Material Type: Artigo
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Preparation of Carbon Material Derived from Walnut Shell and Its Gas-Sensing PropertiesLiu, L. X. ; Wu, Z. F. ; Sun, Q. H. ; Zhang, M. ; Duan, H. M.Journal of electronic materials, 2023-05, Vol.52 (5), p.3092-3102 [Periódico revisado por pares]New York: Springer USTexto completo disponível |