Resultados de 1 a 10 de 79 para Busca Geral
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Journal of Electronic Materials
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Artigo
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An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling RateSeo, Sun-Kyoung ; Kang, Sung K. ; Shih, Da-Yuan ; Lee, Hyuck MoJournal of electronic materials, 2009-02, Vol.38 (2), p.257-265 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
| 2 |
Material Type: Artigo
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Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and DepositionJung, Myung-Won ; Kang, Sung K. ; Lee, Jae-HoJournal of electronic materials, 2014-01, Vol.43 (1), p.290-298 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
| 3 |
Material Type: Artigo
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Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying additionKANG, Sung K ; LEONARD, Donovan ; SHIH, Da-Yuan ; GIGNAC, Lynne ; HENDERSON, D. W ; CHO, Sungil ; JIN YUJournal of electronic materials, 2006-03, Vol.35 (3), p.479-485 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
| 4 |
Material Type: Artigo
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Oxidation study of pure tin and its alloys via electrochemical reduction analysisCHO, Sungil ; JIN YU ; KANG, Sung K ; SHIH, Da-YuanJournal of electronic materials, 2005-05, Vol.34 (5), p.635-642 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
| 5 |
Material Type: Artigo
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Studies of the mechanical and electrical properties of lead-free solder jointsKANG, S. K ; CHOI, W. K ; YIM, M. J ; SHIH, D. YJournal of electronic materials, 2002-11, Vol.31 (11), p.1292-1303 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
| 6 |
Material Type: Artigo
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Lead (Pb)-free solders for electronic packagingKang, Sung K. ; Sarkhel, Amit K.Journal of electronic materials, 1994-08, Vol.23 (8), p.701-707 [Periódico revisado por pares]Texto completo disponível |
| 7 |
Material Type: Artigo
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Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal agingMOON GI CHO ; KANG, Sung K ; SHIH, Da-Yuan ; HYUCK MO LEEJournal of electronic materials, 2007-11, Vol.36 (11), p.1501-1509 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
| 8 |
Material Type: Artigo
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Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich soldersKANG, S. K ; RAI, R. S ; PURUSHOTHAMAN, SJournal of electronic materials, 1996-07, Vol.25 (7), p.1113-1120 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
| 9 |
Material Type: Artigo
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Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free soldersLAURO, Paul ; KANG, Sung K ; WON KYOUNG CHOI ; SHIH, Da-YuanJournal of electronic materials, 2003-12, Vol.32 (12), p.1432-1440 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
| 10 |
Material Type: Artigo
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Development of conducting adhesive materials for microelectronic applicationsKang, Sung K ; Purushothaman, SJournal of electronic materials, 1999-11, Vol.28 (11), p.1314-1318 [Periódico revisado por pares]Warrendale: Springer Nature B.VTexto completo disponível |
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