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Material Type: Artigo
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Defect-Oriented Test: Effectiveness in High Volume ManufacturingHapke, Friedrich ; Howell, Will ; Maxwell, Peter ; Brazil, Edward ; Venkataraman, Srikanth ; Dutta, Rudrajit ; Glowatz, Andreas ; Fast, Anja ; Rajski, JanuszIEEE transactions on computer-aided design of integrated circuits and systems, 2021-03, Vol.40 (3), p.584-597 [Periódico revisado por pares]IEEETexto completo disponível |
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Material Type: Artigo
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Analog Defect Injection and Fault Simulation Techniques: A Systematic Literature ReviewAzam, Sadia ; Dall'Ora, Nicola ; Fraccaroli, Enrico ; Gillon, Renaud ; Fummi, FrancoIEEE transactions on computer-aided design of integrated circuits and systems, 2024-01, Vol.43 (1), p.1-1 [Periódico revisado por pares]IEEETexto completo disponível |
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3 |
Material Type: Artigo
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An Automatic Circuit Design Framework for Level Shifter CircuitsHong, Jiwoo ; Kim, Sunghoon ; Jeon, DongsukIEEE transactions on computer-aided design of integrated circuits and systems, 2022-12, Vol.41 (12), p.5169-5181 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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4 |
Material Type: Artigo
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Cell-Aware TestHapke, Friedrich ; Redemund, Wilfried ; Glowatz, Andreas ; Rajski, Janusz ; Reese, Michael ; Hustava, Marek ; Keim, Martin ; Schloeffel, Juergen ; Fast, AnjaIEEE transactions on computer-aided design of integrated circuits and systems, 2014-09, Vol.33 (9), p.1396-1409 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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5 |
Material Type: Artigo
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A Study of the Electroforming Process in 1T1R Memory ArraysSon, Seokki ; Torre, Camilla La ; Kindsmuller, Andreas ; Rana, Vikas ; Menzel, StephanIEEE transactions on computer-aided design of integrated circuits and systems, 2023-02, Vol.42 (2), p.558-568 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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6 |
Material Type: Artigo
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Leakage Models for High-Level Power EstimationHelms, Domenik ; Eilers, Reef ; Metzdorf, Malte ; Nebel, WolfgangIEEE transactions on computer-aided design of integrated circuits and systems, 2018-08, Vol.37 (8), p.1627-1639 [Periódico revisado por pares]New York: IEEETexto completo disponível |