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Error accumulation in multiple cycles of still image compression and color transformations

Domanski, M ; Rakowski, K

IEEE International Conference on Image Processing 2005, 2005, Vol.1, pp.I-809

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2
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Lossless and near-lossless image compression with color transformations

Domanski, M ; Rakowski, K

Proceedings 2001 International Conference on Image Processing (Cat. No.01CH37205), 2001, Vol.3, pp.454-457 vol.3

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3
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A simple technique for near-lossless coding of color images

Domanski, M ; Rakowski, K

2000 IEEE International Symposium on Circuits and Systems (ISCAS), 2000, Vol.3, pp.299-302 vol.3

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4
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Artigo
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CMOS-Integrated Poly-SiGe Piezoresistive Pressure Sensor

Gonzalez, P ; Rakowski, M ; San Segundo, D ; Severi, S ; de Meyer, K ; Witvrouw, A

IEEE Electron Device Letters, August 2012, Vol.33(8), pp.1204-1206 [Periódico revisado por pares]

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5
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Low-Power, 10-Gbps 1.5-Vpp differential CMOS driver for a silicon electro-optic ring modulator

Rakowski, M ; Ryckaert, J ; Pantouvaki, M ; Hui Yu ; Bogaerts, W ; de Meyer, K ; Steyaert, M ; Absil, P. P ; Van Campenhout, J

Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, September 2012, pp.1-6

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6
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Low-power, low-penalty, flip-chip integrated, 10Gb/s ring-based 1V CMOS photonics transmitter

Rakowski, M ; Pantouvaki, M ; Hui Yu ; Bogaerts, W ; de Meyer, K ; Steyaert, M ; Snyder, B ; O'Brien, P ; Ryckaert, J ; Absil, P ; Van Campenhout, J

2013 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), March 2013, pp.1-3

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7
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Ata de Congresso
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Temperature dependent electrical characteristics of through-si-via (TSV) interconnections

Katti, G ; Mercha, A ; Stucchi, M ; Tokei, Zs ; Velenis, D ; Van Olmen, J ; Huyghebaert, C ; Jourdain, A ; Rakowski, M ; Debusschere, I ; Soussan, P ; Oprins, H ; Dehaene, W ; De Meyer, K ; Travaly, Y ; Beyne, E ; Biesemans, S ; Swinnen, B

2010 IEEE International Interconnect Technology Conference, June 2010, pp.1-3

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8
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Artigo
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300-mm Monolithic Silicon Photonics Foundry Technology

Giewont, Ken ; Hu, Shuren ; Peng, Bo ; Rakowski, Michal ; Rauch, Stewart ; Rosenberg, Jessie C ; Sahin, Asli ; Stobert, Ian ; Stricker, Andy ; Nummy, Karen ; Anderson, Frederick A ; Ayala, Javier ; Barwicz, Tymon ; Bian, Yusheng ; Dezfulian, Kevin K ; Gill, Douglas M ; Houghton, Thomas

IEEE Journal of Selected Topics in Quantum Electronics, September 2019, Vol.25(5), pp.1-11 [Periódico revisado por pares]

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9
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High yield sub-0.1µm2 6T-SRAM cells, featuring high-k/metal-gate finfet devices, double gate patterning, a novel fin etch strategy, full-field EUV lithography and optimized junction design & layout

Horiguchi, N ; Demuynck, S ; Ercken, M ; Locorotondo, S ; Lazzarino, F ; Altamirano, E ; Huffman, C ; Brus, S ; Demand, M ; Struyf, H ; De Backer, J ; Hermans, J ; Delvaux, C ; Vandeweyer, T ; Baerts, C ; Mannaert, G ; Truffert, V ; Verluijs, J ; Alaerts, W ; Dekkers, H ; Ong, P ; Heylen, N ; Kellens, K ; Volders, H ; Hikavyy, A ; Vrancken, C ; Rakowski, M ; Verhaegen, S ; Vandenberghe, G ; Beyer, G ; Lauwers, A ; Absil, P ; Hoffman, T ; Ronse, K ; Biesemans, S

2010 Symposium on VLSI Technology, June 2010, pp.23-24

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Design issues and considerations for low-cost 3D TSV IC technology

Van Der Plas, G ; Limaye, P ; Mercha, A ; Oprins, H ; Torregiani, C ; Thijs, S ; Linten, D ; Stucchi, M ; Guruprasad, K ; Velenis, D ; Shinichi, D ; Cherman, V ; Vandevelde, B ; Simons, V ; De Wolf, I ; Labie, R ; Perry, D ; Bronckers, S ; Minas, N ; Cupac, M ; Ruythooren, W ; Van Olmen, J ; Phommahaxay, A ; de Potter de Ten Broeck, M ; Opdebeeck, A ; Rakowski, M ; De Wachter, B ; Dehan, M ; Nelis, M ; Agarwal, R ; Dehaene, W ; Travaly, Y ; Marchal, P ; Beyne, E

2010 IEEE International Solid-State Circuits Conference - (ISSCC), February 2010, pp.148-149

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