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Refinado por: assunto: Plasma remover autor: Agarwal, Ankur remover
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1
On the scaling of rf and dc self-bias voltages with pressure in electronegative capacitively coupled plasmas
On the scaling of rf and dc self-bias voltages with pressure in electronegative capacitively coupled plasmas
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On the scaling of rf and dc self-bias voltages with pressure in electronegative capacitively coupled plasmas

Agarwal, Ankur ; Dorf, Leonid ; Rauf, Shahid ; Collins, Ken

Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films, 2012-03, Vol.30 (2), p.021303-021303-11 [Periódico revisado por pares]

United States: American Vacuum Society

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2
Plasma atomic layer etching using conventional plasma equipment
Plasma atomic layer etching using conventional plasma equipment
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Plasma atomic layer etching using conventional plasma equipment

Agarwal, Ankur ; Kushner, Mark J.

Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films, 2009-01, Vol.27 (1), p.37-50 [Periódico revisado por pares]

United States: American Vacuum Society

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3
Seasoning of plasma etching reactors: Ion energy distributions to walls and real-time and run-to-run control strategies
Seasoning of plasma etching reactors: Ion energy distributions to walls and real-time and run-to-run control strategies
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Seasoning of plasma etching reactors: Ion energy distributions to walls and real-time and run-to-run control strategies

Agarwal, Ankur ; Kushner, Mark J.

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2008-05, Vol.26 (3), p.498-512 [Periódico revisado por pares]

United States: American Vacuum Society

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4
Impact of phase lag on uniformity in pulsed capacitively coupled plasmas
Impact of phase lag on uniformity in pulsed capacitively coupled plasmas
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Impact of phase lag on uniformity in pulsed capacitively coupled plasmas

Agarwal, Ankur ; Rauf, Shahid ; Collins, Ken

Applied physics letters, 2011-07, Vol.99 (2), p.021501-021501-3 [Periódico revisado por pares]

United States: American Institute of Physics

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5
Decreasing high ion energy during transition in pulsed inductively coupled plasmas
Decreasing high ion energy during transition in pulsed inductively coupled plasmas
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Decreasing high ion energy during transition in pulsed inductively coupled plasmas

Agarwal, Ankur ; Stout, Phillip J ; Banna, Samer ; Rauf, Shahid ; Collins, Ken

Applied physics letters, 2012-01, Vol.100 (4), p.044105-044105-4 [Periódico revisado por pares]

United States: American Institute of Physics

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6
Recouping etch rates in pulsed inductively coupled plasmas
Recouping etch rates in pulsed inductively coupled plasmas
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Recouping etch rates in pulsed inductively coupled plasmas

Agarwal, Ankur ; Stout, Phillip J. ; Banna, Samer ; Rauf, Shahid ; Collins, Ken

Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films, 2011-01, Vol.29 (1), p.011017-011017-12 [Periódico revisado por pares]

United States: American Vacuum Society

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7
Effect of simultaneous source and bias pulsing in inductively coupled plasma etching
Effect of simultaneous source and bias pulsing in inductively coupled plasma etching
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Effect of simultaneous source and bias pulsing in inductively coupled plasma etching

Agarwal, Ankur ; Stout, Phillip J ; Banna, Samer ; Rauf, Shahid ; Tokashiki, Ken ; Lee, Jeong-Yun ; Collins, Ken

Journal of applied physics, 2009-11, Vol.106 (10), p.103305-103305-12 [Periódico revisado por pares]

United States: American Institute of Physics

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8
Pulsed high-density plasmas for advanced dry etching processes
Pulsed high-density plasmas for advanced dry etching processes
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Pulsed high-density plasmas for advanced dry etching processes

Banna, Samer ; Agarwal, Ankur ; Cunge, Gilles ; Darnon, Maxime ; Pargon, Erwine ; Joubert, Olivier

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2012-07, Vol.30 (4), p.040801-040801-29 [Periódico revisado por pares]

United States: American Vacuum Society

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