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Skin effect and material degradation of lead-free solder joint under AC
Skin effect and material degradation of lead-free solder joint under AC
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Skin effect and material degradation of lead-free solder joint under AC

Yao Wei ; Cemal, B.

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.408-412

IEEE

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2
Modeling Joule heating in carbon nanotubes with Monte Carlo simulations
Modeling Joule heating in carbon nanotubes with Monte Carlo simulations
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Modeling Joule heating in carbon nanotubes with Monte Carlo simulations

Ragab, Tarek ; Basaran, Cemal

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.20-29

IEEE

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3
Review of Joule heating in graphene nano-ribbon
Review of Joule heating in graphene nano-ribbon
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Review of Joule heating in graphene nano-ribbon

Yanbiao Chu ; Basaran, C.

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.7-9

IEEE

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4
Damage of SAC405 solder joint under PDC
Damage of SAC405 solder joint under PDC
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Damage of SAC405 solder joint under PDC

Wei Yao ; Basaran, C.

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.403-407

IEEE

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5
A velocity averaging method for bridging molecular dynamics with finite element analysis
A velocity averaging method for bridging molecular dynamics with finite element analysis
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A velocity averaging method for bridging molecular dynamics with finite element analysis

Yongchang Lee ; Basaran, C.

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.399-402

IEEE

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6
Mean time to failure of SnAgCuNi solder joints under DC
Mean time to failure of SnAgCuNi solder joints under DC
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Mean time to failure of SnAgCuNi solder joints under DC

Basaran, Cemal ; Shidong Li ; Hopkins, D. C. ; Wei Yao

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.518-520

IEEE

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7
Solder joint grain boundary structure and diffusivity via molecular dynamics simulations
Solder joint grain boundary structure and diffusivity via molecular dynamics simulations
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Solder joint grain boundary structure and diffusivity via molecular dynamics simulations

Basaran, C. ; Sellers, M. S. ; Schultz, A. J. ; Kofke, D. A. ; Yongchang Lee

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.514-517

IEEE

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8
Statistical phase shifting step estimation based on continuous wavelet transform for high resolution interferometry metrology
Statistical phase shifting step estimation based on continuous wavelet transform for high resolution interferometry metrology
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Statistical phase shifting step estimation based on continuous wavelet transform for high resolution interferometry metrology

Bicheng Chen ; Basaran, Cemal

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010, p.1-6

IEEE

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9
Low temperature electromigration and thermomigration in lead-free solder joints
Low temperature electromigration and thermomigration in lead-free solder joints
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Low temperature electromigration and thermomigration in lead-free solder joints

Hamid, Mohd Foad Abdul ; Basaran, Cemal

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2008, p.1-6

IEEE

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10
Computational simulation of electromigration induced damage in copper interconnects
Computational simulation of electromigration induced damage in copper interconnects
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Computational simulation of electromigration induced damage in copper interconnects

Basaran, Cemal ; Lin, Minghui ; Li, Shidong

Proceedings of the 2007 Summer Computer Simulation Conference, 2007, p.261-268

San Diego, CA, USA: Society for Computer Simulation International

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