Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Electrostatic Layer Jamming Variable Stiffness for Soft RoboticsWang, Tao ; Zhang, Jinhua ; Li, Yue ; Hong, Jun ; Wang, Michael YuIEEE/ASME transactions on mechatronics, 2019-04, Vol.24 (2), p.424-433 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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2 |
Material Type: Artigo
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Convolutional Neural Network for Wafer Surface Defect Classification and the Detection of Unknown Defect ClassCheon, Sejune ; Lee, Hankang ; Kim, Chang Ouk ; Lee, Seok HyungIEEE transactions on semiconductor manufacturing, 2019-05, Vol.32 (2), p.163-170 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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3 |
Material Type: Artigo
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A CNN-Based Transfer Learning Method for Defect Classification in Semiconductor ManufacturingImoto, Kazunori ; Nakai, Tomohiro ; Ike, Tsukasa ; Haruki, Kosuke ; Sato, YoshiyukiIEEE transactions on semiconductor manufacturing, 2019-11, Vol.32 (4), p.455-459 [Periódico revisado por pares]IEEETexto completo disponível |
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4 |
Material Type: Artigo
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Origami Robot: A Self-Folding Paper Robot With an Electrothermal Actuator Created by PrintingShigemune, Hiroki ; Maeda, Shingo ; Hara, Yusuke ; Hosoya, Naoki ; Hashimoto, ShujiIEEE/ASME transactions on mechatronics, 2016-12, Vol.21 (6), p.2746-2754 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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5 |
Material Type: Artigo
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Deep Learning for Classification of the Chemical Composition of Particle Defects on Semiconductor WafersO'Leary, Jared ; Sawlani, Kapil ; Mesbah, AliIEEE transactions on semiconductor manufacturing, 2020-02, Vol.33 (1), p.72-85 [Periódico revisado por pares]IEEETexto completo disponível |
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6 |
Material Type: Artigo
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Origami-Inspired Printed RobotsOnal, Cagdas D. ; Tolley, Michael T. ; Wood, Robert J. ; Rus, DanielaIEEE/ASME transactions on mechatronics, 2015-10, Vol.20 (5), p.2214-2221 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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7 |
Material Type: Artigo
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Otariidae-Inspired Soft-Robotic Supernumerary Flippers by Fabric Kirigami and OrigamiLiu, Sicong ; Zhu, Yuming ; Zhang, Zicong ; Fang, Zhonggui ; Tan, Jiyong ; Peng, Jing ; Song, Chaoyang ; Asada, H. Harry ; Wang, ZhengIEEE/ASME transactions on mechatronics, 2021-10, Vol.26 (5), p.2747-2757 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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8 |
Material Type: Artigo
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Anomaly Detection and Segmentation for Wafer Defect Patterns Using Deep Convolutional Encoder-Decoder Neural Network Architectures in Semiconductor ManufacturingNakazawa, Takeshi ; Kulkarni, Deepak V.IEEE transactions on semiconductor manufacturing, 2019-05, Vol.32 (2), p.250-256 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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9 |
Material Type: Artigo
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Design and Characterization of a Bellows-Driven Soft Pneumatic ActuatorHashem, Ryman ; Stommel, Martin ; Cheng, Leo K. ; Xu, WeiliangIEEE/ASME transactions on mechatronics, 2021-10, Vol.26 (5), p.2327-2338 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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10 |
Material Type: Artigo
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Wafer Defect Pattern Recognition and Analysis Based on Convolutional Neural NetworkYu, Naigong ; Xu, Qiao ; Wang, HongluIEEE transactions on semiconductor manufacturing, 2019-11, Vol.32 (4), p.566-573 [Periódico revisado por pares]IEEETexto completo disponível |