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Refinado por: Base de dados/Biblioteca: IEEE Electronic Library (IEL) Journals remover Nome da Publicação: Ieee Transactions On Components, Packaging, And Manufacturing Technology remover
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Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions
Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions
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Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Garimella, Suresh V. ; Persoons, Tim ; Weibel, Justin A. ; Gektin, Vadim

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-08, Vol.7 (8), p.1191-1205 [Periódico revisado por pares]

Piscataway: IEEE

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2
Metallic 3-D Printed Rectangular Waveguides for Millimeter-Wave Applications
Metallic 3-D Printed Rectangular Waveguides for Millimeter-Wave Applications
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Metallic 3-D Printed Rectangular Waveguides for Millimeter-Wave Applications

Bing Zhang ; Zirath, Herbert

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-05, Vol.6 (5), p.796-804 [Periódico revisado por pares]

Piscataway: IEEE

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3
Die Attach Materials for High Temperature Applications: A Review
Die Attach Materials for High Temperature Applications: A Review
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Die Attach Materials for High Temperature Applications: A Review

Manikam, V R ; Kuan Yew Cheong

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-04, Vol.1 (4), p.457-478 [Periódico revisado por pares]

Piscataway, NJ: IEEE

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4
Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics
Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics
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Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics

Yoonjin Won ; Jungwan Cho ; Agonafer, Damena ; Asheghi, Mehdi ; Goodson, Kenneth E.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-06, Vol.5 (6), p.737-744 [Periódico revisado por pares]

Piscataway: IEEE

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5
Power Delivery for High-Performance Microprocessors-Challenges, Solutions, and Future Trends
Power Delivery for High-Performance Microprocessors-Challenges, Solutions, and Future Trends
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Power Delivery for High-Performance Microprocessors-Challenges, Solutions, and Future Trends

Radhakrishnan, Kaladhar ; Swaminathan, Madhavan ; Bhattacharyya, Bidyut K.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-04, Vol.11 (4), p.655-671 [Periódico revisado por pares]

Piscataway: IEEE

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6
Design of Compact Bandpass Filters Using Quarter-Mode and Eighth-Mode SIW Cavities
Design of Compact Bandpass Filters Using Quarter-Mode and Eighth-Mode SIW Cavities
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Design of Compact Bandpass Filters Using Quarter-Mode and Eighth-Mode SIW Cavities

Li, Peng ; Chu, Hui ; Chen, Ru-Shan

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-06, Vol.7 (6), p.956-963 [Periódico revisado por pares]

Piscataway: IEEE

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7
A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications
A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications
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A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications

Chu, Hui ; Guo, Yong-Xin

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-06, Vol.7 (6), p.964-973 [Periódico revisado por pares]

Piscataway: IEEE

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8
Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics
Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics
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Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics

Shuodao Wang ; Yonggang Huang ; Rogers, John A.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-09, Vol.5 (9), p.1201-1218 [Periódico revisado por pares]

United States: IEEE

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9
Two-Step Plasma Treatment on Copper Surface for Low-Temperature Cu Thermo-Compression Bonding
Two-Step Plasma Treatment on Copper Surface for Low-Temperature Cu Thermo-Compression Bonding
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Two-Step Plasma Treatment on Copper Surface for Low-Temperature Cu Thermo-Compression Bonding

Park, Haesung ; Kim, Sarah Eunkyung

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-02, Vol.10 (2), p.332-338 [Periódico revisado por pares]

Piscataway: IEEE

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10
Automatic Industry PCB Board DIP Process Defect Detection System Based on Deep Ensemble Self-Adaption Method
Automatic Industry PCB Board DIP Process Defect Detection System Based on Deep Ensemble Self-Adaption Method
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Automatic Industry PCB Board DIP Process Defect Detection System Based on Deep Ensemble Self-Adaption Method

Li, Yu-Ting ; Kuo, Paul ; Guo, Jiun-In

IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-02, Vol.11 (2), p.312-323 [Periódico revisado por pares]

Piscataway: IEEE

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