Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Behaviors of the interface and matrix for the Ag/Cu bimetallic laminates prepared by roll bonding and diffusion annealingZhang, L. ; Meng, L. ; Zhou, S.P. ; Yang, F.T.Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2004-04, Vol.371 (1), p.65-71 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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Material Type: Artigo
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Investigation of vacancy formation by a jogged dissociated dislocation with large-scale molecular dynamics and dislocation energeticsZhou, S.J. ; Preston, D.L. ; Louchet, F.Acta materialia, 1999-07, Vol.47 (9), p.2695-2703 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
3 |
Material Type: Artigo
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Diffusion annealing of copper–silver bimetallic strips at different temperaturesMeng, L. ; Zhou, S.P. ; Yang, F.T. ; Shen, Q.J. ; Liu, M.S.Materials characterization, 2001-09, Vol.47 (3), p.269-274 [Periódico revisado por pares]New York, NY: Elsevier IncTexto completo disponível |
4 |
Material Type: Artigo
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Role of Co on microstructure, crystallization behavior and soft magnetic properties of (Fe sub(1-x)Co sub(x)) sub(84)Si sub(4)B sub(8)P sub(3)Cu sub(1) nanocrystalline alloysXiang, R ; Zhou, S X ; Dong, B S ; Zhang, G Q ; Li, Z Z ; Wang, Y GJournal of materials science. Materials in electronics, 2015-04, Vol.26 (4), p.2076-2081 [Periódico revisado por pares]Texto completo disponível |
5 |
Material Type: Artigo
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Effect of diffusion annealing on microstructure and composition distribution in interfacial regions of silver-copper bimetallic sheetsMeng, L ; Chen, Y ; Liu, M ; Zhou, S ; Yang, F ; Lin, DChin shu hsüeh pao, 2001-01, Vol.37 (1), p.47-51 [Periódico revisado por pares]Sem texto completo |
6 |
Material Type: Artigo
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Multiscale Numerical Simulation of the Shaped Charge Jet Generated from Tungsten-Copper Powder LinerJintao, Liu ; Hongnian, Cai ; Fuchi, Wang ; Qunbo, FanJournal of physics. Conference series, 2013-01, Vol.419 (1), p.12045-8 [Periódico revisado por pares]Bristol: IOP PublishingTexto completo disponível |
7 |
Material Type: Artigo
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Study on the Microstructure and Deformation Behavior of Ultrafine-Crystalline Cu-Y RibbonsDu, Zhi Wei ; Sun, Z.M. ; Shao, B.L. ; Liu, A.S.Materials science forum, 2009-01, Vol.610-613, p.591-597 [Periódico revisado por pares]Sem texto completo |
8 |
Material Type: Artigo
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Microstructure and Properties of Cu-Cr-Nd Alloys after Cold Deformation and Solid Solution AgingZhou, JunJi xie gong cheng cai liao, 2012-05, Vol.36 (5), p.62-64Sem texto completo |
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Material Type: Artigo
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Microstructure of Semi-Solid ZCuSn10 Copper Alloy Fabricated by SIMA Process with Cold-Rolling and Re-MeltingWu, Longbiao ; Xiao, Han ; Wang, Jia ; Lu, Dehong ; Zhou, Rongfeng ; Zhou, RongXīyǒu jīnshǔ, 2015-03, Vol.39 (3), p.214-220Sem texto completo |
10 |
Material Type: Artigo
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MICROSTRUCTURES AND PROPERTIES OF LEAD-FREE FREE-CUTTING GRAPHITE-BRASS PREPARED BY GRAPHITIZATION OF CEMENTITEXue, Yingyu ; Tang, Jiancheng ; Zhuo, Haiou ; Ye, Nan ; Wu, Tong ; Zhou, XushengChin shu hsüeh pao, 2015-02, Vol.51 (2), p.223-229 [Periódico revisado por pares]Sem texto completo |