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Material Type: Artigo
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Low Temperature Hydrophilic SiC Wafer Level Direct Bonding for Ultrahigh-Voltage Device ApplicationsZhang, Wenting ; Zhang, Caorui ; Wu, Junmin ; Yang, Fei ; An, Yunlai ; Hu, Fangjing ; Fan, JiMicromachines (Basel), 2021-12, Vol.12 (12), p.1575 [Periódico revisado por pares]Switzerland: MDPI AGTexto completo disponível |