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A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects
A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects
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A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects

Gomez, Juan ; Basaran, Cemal

International journal of solids and structures, 2005-06, Vol.42 (13), p.3744-3772 [Periódico revisado por pares]

Elsevier Ltd

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2
A thermodynamics based damage mechanics model for particulate composites
A thermodynamics based damage mechanics model for particulate composites
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A thermodynamics based damage mechanics model for particulate composites

Basaran, Cemal ; Nie, Shihua

International journal of solids and structures, 2007-02, Vol.44 (3), p.1099-1114 [Periódico revisado por pares]

Elsevier Ltd

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3
Electromigration induced strain field simulations for nanoelectronics lead-free solder joints
Electromigration induced strain field simulations for nanoelectronics lead-free solder joints
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Electromigration induced strain field simulations for nanoelectronics lead-free solder joints

Basaran, Cemal ; Lin, Minghui

International journal of solids and structures, 2007-07, Vol.44 (14), p.4909-4924 [Periódico revisado por pares]

Elsevier Ltd

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4
Modeling ultrasonic vibration fatigue with unified mechanics theory
Modeling ultrasonic vibration fatigue with unified mechanics theory
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Modeling ultrasonic vibration fatigue with unified mechanics theory

Lee, Hsiao Wei ; Basaran, Cemal ; Egner, Halina ; Lipski, Adam ; Piotrowski, Michał ; Mroziński, Stanisław ; Bin Jamal M, Noushad ; Lakshmana Rao, Chebolu

International journal of solids and structures, 2022-02, Vol.236-237, p.111313, Article 111313 [Periódico revisado por pares]

New York: Elsevier Ltd

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5
A micromechanical model for effective elastic properties of particulate composites with imperfect interfacial bonds
A micromechanical model for effective elastic properties of particulate composites with imperfect interfacial bonds
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A micromechanical model for effective elastic properties of particulate composites with imperfect interfacial bonds

Nie, Shihua ; Basaran, Cemal

International journal of solids and structures, 2005-07, Vol.42 (14), p.4179-4191 [Periódico revisado por pares]

Elsevier Ltd

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6
Nanoindentation of Pb/Sn solder alloys; experimental and finite element simulation results
Nanoindentation of Pb/Sn solder alloys; experimental and finite element simulation results
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Nanoindentation of Pb/Sn solder alloys; experimental and finite element simulation results

Gomez, Juan ; Basaran, Cemal

International journal of solids and structures, 2006-03, Vol.43 (6), p.1505-1527 [Periódico revisado por pares]

Elsevier Ltd

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7
A thermodynamic model for electrical current induced damage
A thermodynamic model for electrical current induced damage
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A thermodynamic model for electrical current induced damage

Basaran, Cemal ; Lin, Minghui ; Ye, Hua

International journal of solids and structures, 2003-12, Vol.40 (26), p.7315-7327 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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8
Deformation of solder joint under current stressing and numerical simulation––I
Deformation of solder joint under current stressing and numerical simulation––I
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Deformation of solder joint under current stressing and numerical simulation––I

Ye, Hua ; Basaran, Cemal ; Hopkins, Douglas C.

International journal of solids and structures, 2004-09, Vol.41 (18), p.4939-4958 [Periódico revisado por pares]

Elsevier Ltd

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9
Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing
Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing
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Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

Ye, Hua ; Basaran, Cemal ; Hopkins, Douglas C.

International journal of solids and structures, 2004-05, Vol.41 (9), p.2743-2755 [Periódico revisado por pares]

Elsevier Ltd

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10
Mechanical degradation of microelectronics solder joints under current stressing
Mechanical degradation of microelectronics solder joints under current stressing
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Mechanical degradation of microelectronics solder joints under current stressing

Ye, Hua ; Basaran, Cemal ; Hopkins, Douglas C.

International journal of solids and structures, 2003-12, Vol.40 (26), p.7269-7284 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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