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Refinado por: Base de dados/Biblioteca: IEEE Electronic Library (IEL) Conference Proceedings remover
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1
W2F: A Weakly-Supervised to Fully-Supervised Framework for Object Detection
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Ata de Congresso
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W2F: A Weakly-Supervised to Fully-Supervised Framework for Object Detection

Zhang, Yongqiang ; Bai, Yancheng ; Ding, Mingli ; Li, Yongqiang ; Ghanem, Bernard

2018 IEEE/CVF Conference on Computer Vision and Pattern Recognition, 2018, p.928-936

IEEE

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2
Introducing FCA, a new alloy for Power Systems on a chip and Wafer Level Magnetic applications
Material Type:
Ata de Congresso
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Introducing FCA, a new alloy for Power Systems on a chip and Wafer Level Magnetic applications

Liakopoulos, T. ; Panda, A. ; Wilkowski, M. ; Lotfi, A. ; Tan, K. H. ; Li Zhang ; Chiming Lai ; Dong Chen

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012, p.949-954

IEEE

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3
Design considerations for GaN HEMT multichip halfbridge module for high-frequency power converters
Material Type:
Ata de Congresso
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Design considerations for GaN HEMT multichip halfbridge module for high-frequency power converters

Fang Luo ; Zheng Chen ; Lingxiao Xue ; Mattavelli, Paolo ; Boroyevich, Dushan ; Hughes, Brian

2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014, 2014, p.537-544

IEEE

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4
Towards Interoperable Enclave Attestation: Learnings from Decades of Academic Work
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Ata de Congresso
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Towards Interoperable Enclave Attestation: Learnings from Decades of Academic Work

Arto Niemi ; Sampo Sovio ; Jan-Erik Ekberg

Proceedings of the XXth Conference of Open Innovations Association FRUCT, 2022, Vol.31 (1), p.189-200 [Periódico revisado por pares]

FRUCT

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5
Accurate temperature-dependent integrated circuit leakage power estimation is easy
Material Type:
Ata de Congresso
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Accurate temperature-dependent integrated circuit leakage power estimation is easy

Liu, Yongpan ; Dick, Robert ; Shang, Li ; Yang, Huazhong

2007 Design, Automation & Test in Europe Conference & Exhibition, 2007, p.1526-1531

EDA Consortium

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6
Optimization of electronic packaging structure taking into account of its life cycle energy consumption and environmental pollution
Material Type:
Ata de Congresso
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Optimization of electronic packaging structure taking into account of its life cycle energy consumption and environmental pollution

Zhou, Z. P. ; Cai, M. ; Yang, D. G. ; Chen, W. B.

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012, p.834-836

IEEE

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7
Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip
Material Type:
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Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip

Wen, Haoran ; Daruwalla, Anosh ; Jeong, Yaesuk ; Gupta, Pranav ; Choi, Jaehoo ; Liu, Chang-Shun ; Ayazi, Farrokh

2018 IEEE/ION Position, Location and Navigation Symposium (PLANS), 2018, p.261-266

IEEE

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8
Aqua-Sim: An NS-2 based simulator for underwater sensor networks
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Aqua-Sim: An NS-2 based simulator for underwater sensor networks

Xie, Peng ; Zhou, Zhong ; Peng, Zheng ; Yan, Hai ; Hu, Tiansi ; Cui, Jun-Hong ; Shi, Zhijie ; Fei, Yunsi ; Zhou, Shengli

OCEANS 2009, 2009, p.1-7 [Periódico revisado por pares]

IEEE

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9
Porous Titanium Nitride electrodes on miniaturised pH sensor for foetal health monitoring application
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Porous Titanium Nitride electrodes on miniaturised pH sensor for foetal health monitoring application

Nguyen, T. ; Journet, B. ; Takhedmit, Hakim ; Lissorgues, Gaelle Bazin

IEEE journal of radio frequency identification (Online), 2022, Vol.5 (2), p.1-4 [Periódico revisado por pares]

IEEE

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10
Mission and design sensitivities for human Mars landers using Hypersonic Inflatable Aerodynamic Decelerators
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Mission and design sensitivities for human Mars landers using Hypersonic Inflatable Aerodynamic Decelerators

Polsgrove, Tara P. ; Thomas, Herbert D. ; Cianciolo, Alicia Dwyer ; Collins, Tim ; Samareh, Jamshid

2017 IEEE Aerospace Conference, 2017, p.1-9

IEEE

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