Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Ata de Congresso
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W2F: A Weakly-Supervised to Fully-Supervised Framework for Object DetectionZhang, Yongqiang ; Bai, Yancheng ; Ding, Mingli ; Li, Yongqiang ; Ghanem, Bernard2018 IEEE/CVF Conference on Computer Vision and Pattern Recognition, 2018, p.928-936IEEETexto completo disponível |
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2 |
Material Type: Ata de Congresso
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Introducing FCA, a new alloy for Power Systems on a chip and Wafer Level Magnetic applicationsLiakopoulos, T. ; Panda, A. ; Wilkowski, M. ; Lotfi, A. ; Tan, K. H. ; Li Zhang ; Chiming Lai ; Dong Chen2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012, p.949-954IEEETexto completo disponível |
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3 |
Material Type: Ata de Congresso
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Design considerations for GaN HEMT multichip halfbridge module for high-frequency power convertersFang Luo ; Zheng Chen ; Lingxiao Xue ; Mattavelli, Paolo ; Boroyevich, Dushan ; Hughes, Brian2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014, 2014, p.537-544IEEETexto completo disponível |
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4 |
Material Type: Ata de Congresso
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Towards Interoperable Enclave Attestation: Learnings from Decades of Academic WorkArto Niemi ; Sampo Sovio ; Jan-Erik EkbergProceedings of the XXth Conference of Open Innovations Association FRUCT, 2022, Vol.31 (1), p.189-200 [Periódico revisado por pares]FRUCTTexto completo disponível |
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5 |
Material Type: Ata de Congresso
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Accurate temperature-dependent integrated circuit leakage power estimation is easyLiu, Yongpan ; Dick, Robert ; Shang, Li ; Yang, Huazhong2007 Design, Automation & Test in Europe Conference & Exhibition, 2007, p.1526-1531EDA ConsortiumTexto completo disponível |
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6 |
Material Type: Ata de Congresso
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Optimization of electronic packaging structure taking into account of its life cycle energy consumption and environmental pollutionZhou, Z. P. ; Cai, M. ; Yang, D. G. ; Chen, W. B.2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012, p.834-836IEEETexto completo disponível |
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7 |
Material Type: Ata de Congresso
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Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chipWen, Haoran ; Daruwalla, Anosh ; Jeong, Yaesuk ; Gupta, Pranav ; Choi, Jaehoo ; Liu, Chang-Shun ; Ayazi, Farrokh2018 IEEE/ION Position, Location and Navigation Symposium (PLANS), 2018, p.261-266IEEETexto completo disponível |
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8 |
Material Type: Ata de Congresso
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Aqua-Sim: An NS-2 based simulator for underwater sensor networksXie, Peng ; Zhou, Zhong ; Peng, Zheng ; Yan, Hai ; Hu, Tiansi ; Cui, Jun-Hong ; Shi, Zhijie ; Fei, Yunsi ; Zhou, ShengliOCEANS 2009, 2009, p.1-7 [Periódico revisado por pares]IEEETexto completo disponível |
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9 |
Material Type: Ata de Congresso
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Porous Titanium Nitride electrodes on miniaturised pH sensor for foetal health monitoring applicationNguyen, T. ; Journet, B. ; Takhedmit, Hakim ; Lissorgues, Gaelle BazinIEEE journal of radio frequency identification (Online), 2022, Vol.5 (2), p.1-4 [Periódico revisado por pares]IEEETexto completo disponível |
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10 |
Material Type: Ata de Congresso
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Mission and design sensitivities for human Mars landers using Hypersonic Inflatable Aerodynamic DeceleratorsPolsgrove, Tara P. ; Thomas, Herbert D. ; Cianciolo, Alicia Dwyer ; Collins, Tim ; Samareh, Jamshid2017 IEEE Aerospace Conference, 2017, p.1-9IEEETexto completo disponível |