Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Nanoedible films for food packaging: a reviewJeevahan, Jeya ; Chandrasekaran, M.Journal of materials science, 2019-10, Vol.54 (19), p.12290-12318 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
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2 |
Material Type: Artigo
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Intelligent Packaging Systems: Sensors and Nanosensors to Monitor Food Quality and SafetyFuertes, Guillermo ; Soto, Ismael ; Carrasco, Raúl ; Vargas, Manuel ; Sabattin, Jorge ; Lagos, Carolina Evoy, StephaneJournal of sensors, 2016-01, Vol.2016, p.1-8 [Periódico revisado por pares]New York: Hindawi Publishing CorporationTexto completo disponível |
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3 |
Material Type: Artigo
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Retracted: Design of Packaging Design Evaluation Architecture Based on Deep LearningProgramming, ScientificScientific programming, 2023-08, Vol.2023, p.1-1 [Periódico revisado por pares]New York: HindawiTexto completo disponível |
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4 |
Material Type: Artigo
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Antimicrobial activity of biocomposite films containing cellulose nanofibrils and ethyl lauroyl arginateSilva, Filomena ; Gracia, Nicolás ; McDonagh, Birgitte H. ; Domingues, Fernanda C. ; Nerín, Cristina ; Chinga-Carrasco, GaryJournal of materials science, 2019-09, Vol.54 (18), p.12159-12170 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
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5 |
Material Type: Artigo
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In Situ Electrical Characterization of Transient Liquid-Phase Sintered AlloysNave, G. ; McCluskey, P.Journal of electronic materials, 2024-03, Vol.53 (3), p.1239-1254 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
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6 |
Material Type: Artigo
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Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure InteractionLee, Jing Rou ; Abdul Aziz, Mohd Sharizal ; Khor, Chu Yee ; Ishak, Mohammad Hafifi Hafiz ; Kamarudin, Roslan ; Ani, F. CheJournal of electronic materials, 2024-03, Vol.53 (3), p.1201-1213 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
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7 |
Material Type: Artigo
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Food Packaging Permeability Behaviour: A ReportSiracusa, Valentina Lapshin, SergeyInternational Journal of Polymer Science, 2012-01, Vol.2012, p.1-11 [Periódico revisado por pares]New York: Hindawi LimitedsTexto completo disponível |
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8 |
Material Type: Artigo
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Retracted: Analytical Facts of Product Designing, Branding, Packaging, and Distributing through Internet of Things ApplicationsMobile Computing, Wireless Communications andWireless communications and mobile computing, 2023-09, Vol.2023, p.1-1 [Periódico revisado por pares]Oxford: HindawiTexto completo disponível |
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9 |
Material Type: Artigo
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Tuning the thermal and insulation properties of bismuth borate glass for SiC power electronics packagingChen, Junwei ; Chen, Wei ; Zhang, Liangzhu ; Yan, Xuyang ; Fan, Jiajie ; Zeng, HuidanJournal of the American Ceramic Society, 2024-04, Vol.107 (4), p.2207-2216 [Periódico revisado por pares]Columbus: Wiley Subscription Services, IncTexto completo disponível |
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10 |
Material Type: Artigo
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Antimicrobial additives for poly(lactic acid) materials and their applications: current state and perspectivesScaffaro, Roberto ; Lopresti, Francesco ; Marino, Andreana ; Nostro, AntoniaApplied microbiology and biotechnology, 2018-09, Vol.102 (18), p.7739-7756 [Periódico revisado por pares]Berlin/Heidelberg: Springer Berlin HeidelbergTexto completo disponível |