Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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PackagingElectronic Design, 2007-05, p.62Nashville: Endeavor Business MediaTexto completo disponível |
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2 |
Material Type: magazinearticle
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Wearable technologies present packaging challengesElectronic design, 2014-04, Vol.62 (4), p.8Endeavor Business MediaTexto completo disponível |
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3 |
Material Type: magazinearticle
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ULTRA-COMPACT DAC PACKS A PERFORMANCE PUNCHElectronic Design, 2004-06, Vol.52 (12), p.24-24Nashville: Endeavor Business MediaTexto completo disponível |
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4 |
Material Type: magazinearticle
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Joint venture targets variable-speed motor controlElectronic Design, 2003-09, Vol.51 (19), p.28-28Nashville: Endeavor Business MediaTexto completo disponível |
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5 |
Material Type: magazinearticle
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Mom, don't throw these cards outSciannamea, MikeElectronic design, 1997-04, Vol.45 (7), p.48WNashville: Endeavor Business MediaTexto completo disponível |
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6 |
Material Type: magazinearticle
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64-bit RISC CPU delivers 260 MIPS, 100 MFLOPSElectronic design, 1998-02, Vol.46 (3), p.152Nashville: Endeavor Business MediaTexto completo disponível |
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7 |
Material Type: Artigo
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Pay Attention to These Power-Device TrendsElectronic Design, 2014-10, Vol.62 (10)Nashville: Endeavor Business MediaTexto completo disponível |
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8 |
Material Type: magazinearticle
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Packaging Chiplets for Performance and Profit: When it comes to chiplets, it's all about packaging technologyWong, BillElectronic design, 2024-03, Vol.72 (2), p.4Endeavor Business Media LLCTexto completo disponível |
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9 |
Material Type: Artigo
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design: Reducing FPGA Power Consumption: FREQUENTLY ASKED QUESTIONSHarris, DanielElectronic Design, 2008-02, Vol.56 (3), p.22Nashville: Endeavor Business MediaTexto completo disponível |
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10 |
Material Type: Artigo
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ELECTRONIC DESIGN: Catalogue Literature ReviewElectronic Design, 2005-08, Vol.53 (18), p.85Nashville: Endeavor Business MediaTexto completo disponível |