Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Tuning the thermal and insulation properties of bismuth borate glass for SiC power electronics packagingChen, Junwei ; Chen, Wei ; Zhang, Liangzhu ; Yan, Xuyang ; Fan, Jiajie ; Zeng, HuidanJournal of the American Ceramic Society, 2024-04, Vol.107 (4), p.2207-2216 [Periódico revisado por pares]Columbus: Wiley Subscription Services, IncTexto completo disponível |
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2 |
Material Type: Artigo
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Retracted: Analytical Facts of Product Designing, Branding, Packaging, and Distributing through Internet of Things ApplicationsMobile Computing, Wireless Communications andWireless communications and mobile computing, 2023-09, Vol.2023, p.1-1 [Periódico revisado por pares]Oxford: HindawiTexto completo disponível |
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3 |
Material Type: Artigo
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Analytical Facts of Product Designing, Branding, Packaging, and Distributing through Internet of Things ApplicationsZhang, Wen ; Xie, Juan Rosales, Hamurabi Gamboa ; Hamurabi Gamboa RosalesWireless communications and mobile computing, 2022-08, Vol.2022, p.1-8 [Periódico revisado por pares]Oxford: HindawiTexto completo disponível |
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4 |
Material Type: Artigo
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Cold sintering process: A new era for ceramic packaging and microwave device developmentGuo, Jing ; Baker, Amanda L. ; Guo, Hanzheng ; Lanagan, Michael ; Randall, Clive A.Journal of the American Ceramic Society, 2017-02, Vol.100 (2), p.669-677 [Periódico revisado por pares]Columbus: Wiley Subscription Services, IncTexto completo disponível |
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5 |
Material Type: Artigo
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Cold sintered LiMgPO4 based composites for low temperature co‐fired ceramic (LTCC) applicationsWang, Dawei ; Chen, Jinrong ; Wang, Ge ; Lu, Zhilun ; Sun, Shikuan ; Li, Jinglei ; Jiang, Juan ; Zhou, Di ; Song, Kaixin ; Reaney, Ian M.Journal of the American Ceramic Society, 2020-11, Vol.103 (11), p.6237-6244 [Periódico revisado por pares]Columbus: Wiley Subscription Services, IncTexto completo disponível |
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6 |
Material Type: Artigo
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Optimization of the vendor's inventory model with multisupplier and multiretailer using fuzzy parametersGarg, Harish ; Chandrasekar, Sugapriya ; Srinivasan, Rajeswari ; DeivanayagamPillai, NagarajanInternational journal of intelligent systems, 2022-11, Vol.37 (11), p.8205-8238 [Periódico revisado por pares]New York: Hindawi LimitedTexto completo disponível |
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7 |
Material Type: Artigo
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Graphic Composition Art of Packaging Visual Communication Design Based on VRWang, Yanna Ning, Xin ; Xin NingWireless communications and mobile computing, 2022-02, Vol.2022, p.1-9 [Periódico revisado por pares]Oxford: HindawiTexto completo disponível |
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8 |
Material Type: Artigo
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Design of Children’s Product Packaging Preference Based on Big Data Machine LearningGao, Yuan Wu, Wenqing ; Wenqing WuWireless communications and mobile computing, 2021, Vol.2021 (1) [Periódico revisado por pares]Oxford: HindawiTexto completo disponível |
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9 |
Material Type: Artigo
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Scheduling a pick and place packaging lineSchettini, Tommaso ; Malucelli, Federico ; Ramalhinho-Lourenço, HelenaSpringer 2023Texto completo disponível |
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10 |
Material Type: Artigo
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Powder‐fed directed energy deposition of soda lime silica glass on glass substratesSpirrett, Fiona ; Datsiou, Kyriaki Corinna ; Magallanes, Marlin ; Ashcroft, Ian ; Goodridge, RuthJournal of the American Ceramic Society, 2023-01, Vol.106 (1), p.227-240 [Periódico revisado por pares]Columbus: Wiley Subscription Services, IncTexto completo disponível |