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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Artigo
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Nanoedible films for food packaging: a reviewJeevahan, Jeya ; Chandrasekaran, M.Journal of materials science, 2019-10, Vol.54 (19), p.12290-12318 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 2 |
Material Type: Artigo
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Antimicrobial activity of biocomposite films containing cellulose nanofibrils and ethyl lauroyl arginateSilva, Filomena ; Gracia, Nicolás ; McDonagh, Birgitte H. ; Domingues, Fernanda C. ; Nerín, Cristina ; Chinga-Carrasco, GaryJournal of materials science, 2019-09, Vol.54 (18), p.12159-12170 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 3 |
Material Type: Artigo
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Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure InteractionLee, Jing Rou ; Abdul Aziz, Mohd Sharizal ; Khor, Chu Yee ; Ishak, Mohammad Hafifi Hafiz ; Kamarudin, Roslan ; Ani, F. CheJournal of electronic materials, 2024-03, Vol.53 (3), p.1201-1213 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 4 |
Material Type: Artigo
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In Situ Electrical Characterization of Transient Liquid-Phase Sintered AlloysNave, G. ; McCluskey, P.Journal of electronic materials, 2024-03, Vol.53 (3), p.1239-1254 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 5 |
Material Type: Artigo
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Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packagingXiong, Ming-yue ; Zhang, LiangJournal of materials science, 2019-01, Vol.54 (2), p.1741-1768 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 6 |
Material Type: Artigo
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The Effects of Core–Shell-Structured SiO2@Ag Spheres in Enhancing the Performance of Ag-Flake-Filled Electrically Conductive Adhesive and Insight into the Conduction MechanismJiang, H. ; Zhou, M. B. ; Zhang, X. P.Journal of electronic materials, 2024-03, Vol.53 (3), p.1272-1283 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 7 |
Material Type: Artigo
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The Effect of Temperature on the Electrical Resistivity of Sn-Bi AlloysTan, Xin F. ; Hao, Qichao ; Zhou, Jiye ; McDonald, Stuart D. ; Sweatman, Keith ; Nogita, KazuhiroJournal of electronic materials, 2024-03, Vol.53 (3), p.1183-1191 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 8 |
Material Type: Artigo
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The Interfacial Reaction of Ni/In/Ni Sandwich Structure During Solid-State Isothermal AgingWang, Yu-Chieh ; Ouyang, Fan-YiJournal of electronic materials, 2024-03, Vol.53 (3), p.1264-1271 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 9 |
Material Type: Artigo
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Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi AlloysHao, Qichao ; Tan, Xin F. ; McDonald, Stuart D. ; Sweatman, Keith ; Akaiwa, Tetsuya ; Nogita, KazuhiroJournal of electronic materials, 2024-03, Vol.53 (3), p.1223-1238 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 10 |
Material Type: Artigo
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Whisker Growth in Sn Coatings: A Review of Current Status and Future ProspectsJagtap, Piyush ; Kumar, PraveenJournal of electronic materials, 2021-03, Vol.50 (3), p.735-766 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
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