Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Ata de Congresso
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Research on product common attribute model with consumption value theory applied in food industryChen, T.-Y ; Liu, Y.-C ; Chen, Y.-M2013 IEEE International Conference on Industrial Engineering and Engineering Management, 2013, p.447-451IEEETexto completo disponível |
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2 |
Material Type: Ata de Congresso
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Galloping amplitude analysis and observation on full-scale test overhead transmission linesLiu, Y. K. ; Fu, Z. C. ; Yang, X. H.2015 IEEE Power & Energy Society General Meeting, 2015, p.1-5IEEETexto completo disponível |
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3 |
Material Type: Ata de Congresso
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Frequency domain limitations of non-negative impulse response non-lowpass filtersLiu, Y ; Bauer, Peter H.2010 IEEE International Symposium on Circuits and Systems (ISCAS), 2010, p.721-724IEEETexto completo disponível |
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4 |
Material Type: Ata de Congresso
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Analysing Frequency Support from DFIG-based Wind Turbines - Impact of Parameters and Initial ConditionsKrpan, M ; Kuzle, I ; Liu, YIET Conference Proceedings, 2018, p.98Stevenage, UK: IETTexto completo disponível |
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5 |
Material Type: Ata de Congresso
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Multisensory five-finger dexterous hand: The DLR/HIT Hand IILiu, H. ; Wu, K. ; Meusel, P. ; Seitz, N. ; Hirzinger, G. ; Jin, M.H. ; Liu, Y.W. ; Fan, S.W. ; Lan, T. ; Chen, Z.P.2008 IEEE/RSJ International Conference on Intelligent Robots and Systems, 2008, p.3692-3697IEEETexto completo disponível |
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6 |
Material Type: Ata de Congresso
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Temperature Effect Kron-Branin Model of Tree Microstrip InterconnectsXu, Z. ; Liu, Y. ; Ravelo, B.2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), 2018, p.457-462IEEETexto completo disponível |
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7 |
Material Type: Ata de Congresso
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A distributed approach to solving overlay mismatching problemLiu, Y. ; Zhuang, Z. ; Xiao, L. ; Ni, L.M.24th International Conference on Distributed Computing Systems, 2004. Proceedings, 2004, p.132-139Los Alamitos CA: IEEETexto completo disponível |
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8 |
Material Type: Ata de Congresso
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Test structures for characterising the integration of EWOD and SAW technologies for microfluidicsLi, Y ; Fu, Y Q ; Flynn, B W ; Parkes, W ; Liu, Y ; Brodie, S ; Terry, J G ; Haworth, L I ; Bunting, A S ; Stevenson, J T M ; Smith, S ; Walton, A J2010 International Conference on Microelectronic Test Structures (ICMTS), 2010, p.52-57IEEETexto completo disponível |
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9 |
Material Type: Ata de Congresso
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A new observation of the germanium outdiffusion effect on the hot carrier and NBTI reliabilities in sub-100nm technology strained-Si/SiGe CMOS devicesChung, S.S. ; Liu, Y.R. ; Yeh, C.F. ; Wu, S.R. ; Lai, C.S. ; Chang, T.Y. ; Ho, J.H. ; Liu, C.Y. ; Huang, C.T. ; Tsai, C.T.Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005, 2005, p.86-87IEEETexto completo disponível |
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10 |
Material Type: Ata de Congresso
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Survivability analysis of telephone access networkLiu, Y. ; Mendiratta, V.B. ; Trivedi, K.S.15th International Symposium on Software Reliability Engineering, 2004, p.367-377Los Alamitos CA: IEEETexto completo disponível |