Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: magazinearticle
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When Should A Process Be Art, Not Science?Hall, Joseph M ; Johnson, M EricHarvard business review, 2009-03, Vol.87 (3), p.58Boston: Harvard Business ReviewTexto completo disponível |
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2 |
Material Type: magazinearticle
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Pioneers, Drivers, Integrators, and GuardiansVickberg, Suzanne M Johnson ; Christfort, KimHarvard business review, 2017-03, p.1Boston: Harvard Business ReviewTexto completo disponível |
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3 |
Material Type: magazinearticle
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Mesure de débit dans les conduites partiellement rempliesLOPEZ, C ; JOHNSON, M ; PEARCE, SL' Eau, l'industrie, les nuisances, 1997 (204), p.73-75Paris: JohanetTexto completo disponível |
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4 |
Material Type: magazinearticle
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The art of case managementJohnson, MThe Case manager, 1999-01, Vol.10 (1), p.70-71United StatesTexto completo disponível |
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5 |
Material Type: magazinearticle
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Magnetoelectronic memories last and lastJohnson, M.IEEE spectrum, 2000-02, Vol.37 (2), p.33-40New York: IEEETexto completo disponível |
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6 |
Material Type: magazinearticle
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A brief chronology of medical device securityBurns, A ; Johnson, M ; Honeyman, PeterCommunications of the ACM, 2016-10, Vol.59 (10), p.66-72New York: ACMTexto completo disponível |
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7 |
Material Type: magazinearticle
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The all-metal spin transistorJohnson, M.IEEE spectrum, 1994-05, Vol.31 (5), p.47-51New York: IEEETexto completo disponível |
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8 |
Material Type: magazinearticle
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Weld repair of wearing surfaces in centrifugal fansJOHNSON, M. HPower Engineering, 2002-07, Vol.106 (7), p.33-36Tulsa, OK: PennWellTexto completo disponível |
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9 |
Material Type: magazinearticle
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Europe prepares for WRC-95: mobile satellite service issuesJohnson, M.IEEE communications magazine, 1995-09, Vol.33 (9), p.124-127IEEETexto completo disponível |
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10 |
Material Type: magazinearticle
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Calibration of a Novel Microstructural Damage Model for Wire BondsYang, L. ; Agyakwa, P. A. ; Johnson, C. M.IEEE transactions on device and materials reliability, 2014-12, Vol.14 (4), p.989-994 [Periódico revisado por pares]New York: IEEETexto completo disponível |