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14 Angstroms: PI Contributes to Next Semiconductor Technology Node Development
14 Angstroms: PI Contributes to Next Semiconductor Technology Node Development
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14 Angstroms: PI Contributes to Next Semiconductor Technology Node Development

PR Newswire, 2024

New York: PR Newswire Association LLC

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New Findings Reported from Himachal Pradesh University Describe Advances in Green Synthesis (Recent advances in green synthesis of diluted magnetic plasmonic-based semiconductor nanomaterials for biomedical applications)
New Findings Reported from Himachal Pradesh University Describe Advances in Green Synthesis (Recent advances in green synthesis of diluted magnetic plasmonic-based semiconductor nanomaterials for biomedical applications)
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New Findings Reported from Himachal Pradesh University Describe Advances in Green Synthesis (Recent advances in green synthesis of diluted magnetic plasmonic-based semiconductor nanomaterials for biomedical applications)

Biotech Week, 2024, p.375

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Sichuan University Reports Findings in Physics
Sichuan University Reports Findings in Physics
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Sichuan University Reports Findings in Physics

Physics Week, 2024, p.393

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New Nanowalls Study Findings Have Been Reported by Investigators at CSIR National Physics Laboratory
New Nanowalls Study Findings Have Been Reported by Investigators at CSIR National Physics Laboratory
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New Nanowalls Study Findings Have Been Reported by Investigators at CSIR National Physics Laboratory

Journal of Engineering, 2024, p.2381

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5
Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP For Its AI and RISC-V Solutions
Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP For Its AI and RISC-V Solutions
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Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP For Its AI and RISC-V Solutions

PR Newswire, 2024

New York: PR Newswire Association LLC

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6
Texas Instruments prices $3.0 billion of investment grade notes
Texas Instruments prices $3.0 billion of investment grade notes
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Texas Instruments prices $3.0 billion of investment grade notes

PR Newswire, 2024

New York: PR Newswire Association LLC

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7
Study Data from University of Patras Update Knowledge of Inorganic Chemistry [Modification of Graphite/siosub2/sub Film Electrodes With Hybrid Organic-inorganic Perovskites for the Detection of Vasoconstrictor Bisartan ...]
Study Data from University of Patras Update Knowledge of Inorganic Chemistry [Modification of Graphite/siosub2/sub Film Electrodes With Hybrid Organic-inorganic Perovskites for the Detection of Vasoconstrictor Bisartan ...]
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Study Data from University of Patras Update Knowledge of Inorganic Chemistry [Modification of Graphite/siosub2/sub Film Electrodes With Hybrid Organic-inorganic Perovskites for the Detection of Vasoconstrictor Bisartan ...]

Chemicals & Chemistry, 2024, p.842

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8
Data on Photoelectrochemicals Described by Researchers at Xiangtan University (In Situ Synergistic Tisub2/subctsubx /sub/wsub18/subosub49/sub Heterostructure for Photoelectrochemical Photode
Data on Photoelectrochemicals Described by Researchers at Xiangtan University (In Situ Synergistic Tisub2/subctsubx /sub/wsub18/subosub49/sub Heterostructure for Photoelectrochemical Photode
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Data on Photoelectrochemicals Described by Researchers at Xiangtan University (In Situ Synergistic Tisub2/subctsubx /sub/wsub18/subosub49/sub Heterostructure for Photoelectrochemical Photode

Biotech Week, 2023, p.95

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9
Studies in the Area of Biohybrids Reported from Harbin Institute of Technology
Studies in the Area of Biohybrids Reported from Harbin Institute of Technology
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Studies in the Area of Biohybrids Reported from Harbin Institute of Technology

Biotech Week, 2023, p.506

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10
CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening at Advanced Semiconductor Wafer-Level Packaging Processes
CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening at Advanced Semiconductor Wafer-Level Packaging Processes
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CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening at Advanced Semiconductor Wafer-Level Packaging Processes

PR Newswire, 2023

New York: PR Newswire Association LLC

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