skip to main content
Idioma:
Refinado por: Base de dados/Biblioteca: Engineered Materials Abstracts remover tipo de recurso: Newsletter Articles remover
Result Number Material Type Add to My Shelf Action Record Details and Options
1
Samsung unveils metal oxide semiconductor sensor for full-high definition webcam
Samsung unveils metal oxide semiconductor sensor for full-high definition webcam
Material Type:
Newsletter Articles 		Adicionar ao Meu Espaço

Samsung unveils metal oxide semiconductor sensor for full-high definition webcam

Anon

New materials. Asia, 2010 (5), p.8-9

Sem texto completo

Citações Citado por
2
Solution-processed thin-film transistor expected to lower costs of electronic paper
Solution-processed thin-film transistor expected to lower costs of electronic paper
Material Type:
Newsletter Articles 		Adicionar ao Meu Espaço

Solution-processed thin-film transistor expected to lower costs of electronic paper

Anon

New materials. Asia, 2010 (2), p.10-11

Sem texto completo

Citações Citado por
3
Joint venture for transmission and distribution business announced
Joint venture for transmission and distribution business announced
Material Type:
Newsletter Articles 		Adicionar ao Meu Espaço

Joint venture for transmission and distribution business announced

Anon

New materials. Asia, 2010 (4), p.3-3

Sem texto completo

Citações Citado por
4
Full high-definition liquid-crystal display panel uses oxide semiconductor
Full high-definition liquid-crystal display panel uses oxide semiconductor
Material Type:
Newsletter Articles 		Adicionar ao Meu Espaço

Full high-definition liquid-crystal display panel uses oxide semiconductor

Anon

New materials. Asia, 2010 (4), p.9-9

Sem texto completo

Citações Citado por
5
High-speed, low power, non-volatile next-generation logic devices
High-speed, low power, non-volatile next-generation logic devices
Material Type:
Newsletter Articles 		Adicionar ao Meu Espaço

High-speed, low power, non-volatile next-generation logic devices

Anon

New materials. Asia, 2010 (2), p.5-6

Sem texto completo

Citações Citado por
6
Technology saves gold in chip wire-bonding process
Technology saves gold in chip wire-bonding process
Material Type:
Newsletter Articles 		Adicionar ao Meu Espaço

Technology saves gold in chip wire-bonding process

Anon

New materials. Asia, 2010 (3), p.5-6

Sem texto completo

Citações Citado por

  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

Buscando em bases de dados remotas. Favor aguardar.