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Microelectromechanical resonators for radio frequency communication applications
Microelectromechanical resonators for radio frequency communication applications
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Microelectromechanical resonators for radio frequency communication applications

Basu, Joydeep ; Bhattacharyya, Tarun Kanti

Microsystem technologies : sensors, actuators, systems integration, 2011-10, Vol.17 (10-11), p.1557-1580 [Periódico revisado por pares]

Berlin/Heidelberg: Springer-Verlag

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Continuously tunable terahertz metamaterial employing a thermal actuator
Continuously tunable terahertz metamaterial employing a thermal actuator
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Continuously tunable terahertz metamaterial employing a thermal actuator

Li, Xiuhan ; Yang, Tianyang ; Zhu, Wangqiang ; Li, Xiaoguang

Microsystem technologies : sensors, actuators, systems integration, 2013-08, Vol.19 (8), p.1145-1151 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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Study of the Radio Frequency (RF) performance of a Wafer-Level Package (WLP) with Through Silicon Vias (TSVs) for the integration of RF-MEMS and micromachined waveguides in the context of 5G and Internet of Things (IoT) applications: Part 1—validation of the 3D modelling approach
Study of the Radio Frequency (RF) performance of a Wafer-Level Package (WLP) with Through Silicon Vias (TSVs) for the integration of RF-MEMS and micromachined waveguides in the context of 5G and Internet of Things (IoT) applications: Part 1—validation of the 3D modelling approach
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Study of the Radio Frequency (RF) performance of a Wafer-Level Package (WLP) with Through Silicon Vias (TSVs) for the integration of RF-MEMS and micromachined waveguides in the context of 5G and Internet of Things (IoT) applications: Part 1—validation of the 3D modelling approach

Iannacci, J.

Microsystem technologies : sensors, actuators, systems integration, 2020-12, Vol.26 (12), p.3799-3812 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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4
Embedded passive components in advanced 3D chips and micro/nano electronic systems
Embedded passive components in advanced 3D chips and micro/nano electronic systems
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Embedded passive components in advanced 3D chips and micro/nano electronic systems

Khan, Muhammad Imran ; Dong, Huang ; Shabbir, Faisal ; Shoukat, Rizwan

Microsystem technologies : sensors, actuators, systems integration, 2018-02, Vol.24 (2), p.869-877 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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5
Nonlinear ceramics for tunable microwave devices: Part II: RF-characterization and component design
Nonlinear ceramics for tunable microwave devices: Part II: RF-characterization and component design
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Nonlinear ceramics for tunable microwave devices: Part II: RF-characterization and component design

Maune, Holger ; Sazegar, Mohsen ; Zheng, Yuliang ; Zhou, Xianghui ; Giere, Andre ; Scheele, Patrick ; Paul, Florian ; Binder, Joachim R. ; Jakoby, Rolf

Microsystem technologies : sensors, actuators, systems integration, 2011-02, Vol.17 (2), p.213-224 [Periódico revisado por pares]

Berlin/Heidelberg: Springer-Verlag

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6
Effect of residual stress on RF MEMS switch
Effect of residual stress on RF MEMS switch
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Effect of residual stress on RF MEMS switch

Dutta, Shankar ; Imran, Mohd ; Pal, Ramjay ; Jain, K. K. ; Chatterjee, R.

Microsystem technologies : sensors, actuators, systems integration, 2011-12, Vol.17 (12), p.1739-1745 [Periódico revisado por pares]

Berlin/Heidelberg: Springer-Verlag

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7
Power processing circuits for electromagnetic, electrostatic and piezoelectric inertial energy scavengers
Power processing circuits for electromagnetic, electrostatic and piezoelectric inertial energy scavengers
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Power processing circuits for electromagnetic, electrostatic and piezoelectric inertial energy scavengers

MITCHESON, P. D ; GREEN, T. C ; YEATMAN, E. M

Microsystem technologies, 2007-07, Vol.13 (11-12), p.1629-1635 [Periódico revisado por pares]

Berlin: Springer

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8
Ring shape anchored RF MEMS contour mode disk resonator for UHF communication applications
Ring shape anchored RF MEMS contour mode disk resonator for UHF communication applications
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Ring shape anchored RF MEMS contour mode disk resonator for UHF communication applications

Baghelani, Masoud ; Ghavifekr, Habib Badri

Microsystem technologies : sensors, actuators, systems integration, 2010-12, Vol.16 (12), p.2123-2130 [Periódico revisado por pares]

Berlin/Heidelberg: Springer-Verlag

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9
A roller embossing process for rapid fabrication of microlens arrays on glass substrates
A roller embossing process for rapid fabrication of microlens arrays on glass substrates
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A roller embossing process for rapid fabrication of microlens arrays on glass substrates

CHANG, C. Y ; YANG, S. Y ; SHEH, J. L

Microsystem technologies : sensors, actuators, systems integration, 2006-07, Vol.12 (8), p.754-759 [Periódico revisado por pares]

Berlin: Springer

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10
Analytical modeling and simulation of a 2-DOF drive and 1-DOF sense gyro-accelerometer
Analytical modeling and simulation of a 2-DOF drive and 1-DOF sense gyro-accelerometer
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Analytical modeling and simulation of a 2-DOF drive and 1-DOF sense gyro-accelerometer

Verma, Payal ; Gopal, R. ; Arya, Sandeep K.

Microsystem technologies : sensors, actuators, systems integration, 2013-08, Vol.19 (8), p.1239-1248 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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