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Refinado por: Base de dados/Biblioteca: SPIE Conference Proceedings by volume remover assunto: Technology remover
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1
Reliable vacuum packaging using NanoGetters and glass frit bonding
Reliable vacuum packaging using NanoGetters and glass frit bonding
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Reliable vacuum packaging using NanoGetters and glass frit bonding

Sparks, Douglas ; Massoud-Ansari, Sonbol ; Najafi, Nader

Proceedings of SPIE, 2004, Vol.5343, p.70-78

Bellingham WA: SPIE

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2
Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror
Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror
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Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror

Wolter, Alexander ; Schenk, Harald ; Korth, Hilmar ; Lakner, Hubert

Proceedings of SPIE, 2004, Vol.5343, p.176-185

Bellingham WA: SPIE

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3
Lifetime characteristics of ohmic MEMS switches
Lifetime characteristics of ohmic MEMS switches
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Lifetime characteristics of ohmic MEMS switches

Maciel, John ; Majumder, Sumit ; Morrison, Richard ; Lampen, James

Proceedings of SPIE, 2004, Vol.5343, p.9-14

Bellingham WA: SPIE

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4
Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program
Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program
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Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program

Zunino, James L ; Skelton, Donald

Proc. SPIE, 2005, Vol.5716, p.122-130

Bellingham WA: SPIE

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5
Feedback controlled nano-positioner using fiber optic EFPI sensor with novel demodulation technique
Feedback controlled nano-positioner using fiber optic EFPI sensor with novel demodulation technique
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Feedback controlled nano-positioner using fiber optic EFPI sensor with novel demodulation technique

Park, Sang-Wuk ; Kim, Dae-Hyun ; Kim, Chun-Gon

Proc. SPIE, 2005, Vol.5763, p.284-290

Bellingham WA: SPIE

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6
Remote power delivery for hybrid integrated bio-implantable electrical stimulation system
Remote power delivery for hybrid integrated bio-implantable electrical stimulation system
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Remote power delivery for hybrid integrated bio-implantable electrical stimulation system

Gaddam, Venkat R ; Yernagula, Jagadish ; Anantha, Raghavendra R ; Kona, Satish ; Kopparthi, Sunitha ; Chamakura, A ; Ajmera, Pratul K ; Srivastava, Ashok

Proc. SPIE, 2005, Vol.5763, p.20-31

Bellingham WA: SPIE

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7
MEMS characterization using new hybrid laser Doppler vibrometer/strobe video system
MEMS characterization using new hybrid laser Doppler vibrometer/strobe video system
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MEMS characterization using new hybrid laser Doppler vibrometer/strobe video system

Lawrence, Eric M ; Rembe, Christian

Proceedings of SPIE, 2004, Vol.5343, p.45-54

Bellingham WA: SPIE

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8
Reliable bonding using indium-based solders
Reliable bonding using indium-based solders
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Reliable bonding using indium-based solders

Cheong, Jongpil ; Goyal, Abhijat ; Tadigadapa, Srinivas ; Rahn, Christopher

Proceedings of SPIE, 2004, Vol.5343, p.114-120

Bellingham WA: SPIE

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9
Industrial packaging and assembly infrastructure for MOEMS
Industrial packaging and assembly infrastructure for MOEMS
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Industrial packaging and assembly infrastructure for MOEMS

van Heeren, Henne

Proceedings of SPIE, 2004, Vol.5346, p.1-14

Bellingham WA: SPIE

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10
Factors affecting silicon membrane burst strength
Factors affecting silicon membrane burst strength
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Factors affecting silicon membrane burst strength

Henning, Albert K ; Patel, Sapna ; Selser, Michael ; Cozad, Bradford A

Proceedings of SPIE, 2004, Vol.5343, p.145-153

Bellingham WA: SPIE

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