Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Newsletter Articles
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Patent Application Titled "Semiconductor Die Including An Asymmetric Pad Arrays, A Semiconductor Die Stack Including The Semiconductor Die, And A High Bandwidth Memory Including The Semiconductor Die Stack" Published Online (USPTO 20240071967)Journal of Technology & Science, 2024, p.2879NewsRX LLCTexto completo disponível |
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2 |
Material Type: Newsletter Articles
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Patent Application Titled "Semiconductor Device, Semiconductor Structure And Method For Fabricating Semiconductor Device And Semiconductor Structure Using Tilted Etch Process" Published Online (USPTO 20240047217)Journal of Technology & Science, 2024, p.3016NewsRX LLCTexto completo disponível |
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3 |
Material Type: Newsletter Articles
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14 Angstroms: PI Contributes to Next Semiconductor Technology Node DevelopmentPR Newswire, 2024New York: PR Newswire Association LLCSem texto completo |
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4 |
Material Type: Newsletter Articles
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New Findings Reported from Himachal Pradesh University Describe Advances in Green Synthesis (Recent advances in green synthesis of diluted magnetic plasmonic-based semiconductor nanomaterials for biomedical applications)Biotech Week, 2024, p.375NewsRX LLCTexto completo disponível |
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5 |
Material Type: Newsletter Articles
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"Semiconductor Chip, Semiconductor Device, And Semiconductor Package Including The Semiconductor Chip" in Patent Application Approval Process (USPTO 20220278079)Journal of Technology & Science, 2022, p.864NewsRX LLCTexto completo disponível |
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6 |
Material Type: Newsletter Articles
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Patent Application Titled "Semiconductor Chip, Semiconductor Package Including The Semiconductor Chip, Method For Manufacturing The Semiconductor Package" Published Online (USPTO 20220392859)Health & Medicine Week, 2022, p.8870NewsRX LLCTexto completo disponível |
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7 |
Material Type: Newsletter Articles
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TI Chief Financial Officer Rafael Lizardi to speak at Bank of America investor conference: June 5, 2024, 3:20 p.m. Pacific timePR Newswire, 2024New York: PR Newswire Association LLCSem texto completo |
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8 |
Material Type: Newsletter Articles
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Researcher from University of California Details Findings in Applied PhysicsPhysics Week, 2024, p.352NewsRX LLCTexto completo disponível |
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9 |
Material Type: Newsletter Articles
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New Nanocrystals Data Has Been Reported by a Researcher at Northwestern UniversityJournal of Engineering, 2024, p.1832NewsRX LLCTexto completo disponível |
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10 |
Material Type: Newsletter Articles
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CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening at Advanced Semiconductor Wafer-Level Packaging ProcessesPR Newswire, 2023New York: PR Newswire Association LLCSem texto completo |