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Low-Temperature Two-Phase Microchannel Cooling for High-Heat-Flux Thermal Management of Defense Electronics
Low-Temperature Two-Phase Microchannel Cooling for High-Heat-Flux Thermal Management of Defense Electronics
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Low-Temperature Two-Phase Microchannel Cooling for High-Heat-Flux Thermal Management of Defense Electronics

Jaeseon Lee ; Mudawar, I.

IEEE transactions on components and packaging technologies, 2009-06, Vol.32 (2), p.453-465 [Periódico revisado por pares]

New York: IEEE

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2
Application of Two-Phase Spray Cooling for Thermal Management of Electronic Devices
Application of Two-Phase Spray Cooling for Thermal Management of Electronic Devices
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Application of Two-Phase Spray Cooling for Thermal Management of Electronic Devices

Visaria, M. ; Mudawar, I.

IEEE transactions on components and packaging technologies, 2009-12, Vol.32 (4), p.784-793 [Periódico revisado por pares]

New York: IEEE

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3
Two-Phase Spray Cooling of Hybrid Vehicle Electronics
Two-Phase Spray Cooling of Hybrid Vehicle Electronics
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Two-Phase Spray Cooling of Hybrid Vehicle Electronics

Mudawar, I. ; Bharathan, D. ; Kelly, K. ; Narumanchi, S.

IEEE transactions on components and packaging technologies, 2009-06, Vol.32 (2), p.501-512 [Periódico revisado por pares]

New York: IEEE

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4
Flow Boiling in a Micro-Channel Coated With Carbon Nanotubes
Flow Boiling in a Micro-Channel Coated With Carbon Nanotubes
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Flow Boiling in a Micro-Channel Coated With Carbon Nanotubes

Khanikar, V. ; Mudawar, I. ; Fisher, T.S.

IEEE transactions on components and packaging technologies, 2009-09, Vol.32 (3), p.639-649 [Periódico revisado por pares]

New York: IEEE

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5
Application of Flow Boiling for Thermal Management of Electronics in Microgravity and Reduced-Gravity Space Systems
Application of Flow Boiling for Thermal Management of Electronics in Microgravity and Reduced-Gravity Space Systems
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Application of Flow Boiling for Thermal Management of Electronics in Microgravity and Reduced-Gravity Space Systems

Hui Zhang ; Mudawar, I. ; Hasan, M.M.

IEEE transactions on components and packaging technologies, 2009-06, Vol.32 (2), p.466-477 [Periódico revisado por pares]

New York: IEEE

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6
Smart pumpless loop for micro-channel electronic cooling using flat and enhanced surfaces
Smart pumpless loop for micro-channel electronic cooling using flat and enhanced surfaces
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Smart pumpless loop for micro-channel electronic cooling using flat and enhanced surfaces

Mukherjee, S. ; Mudawar, I.

IEEE transactions on components and packaging technologies, 2003-03, Vol.26 (1), p.99-109 [Periódico revisado por pares]

New York: IEEE

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7
Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks
Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks
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Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks

Weilin Qu ; Mudawar, I.

IEEE transactions on components and packaging technologies, 2003-09, Vol.26 (3), p.598-609 [Periódico revisado por pares]

New York: IEEE

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