Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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MEASURING DROPLET SIZE OF AGRICULTURAL SPRAY NOZZLES-MEASUREMENT DISTANCE AND AIRSPEED EFFECTSFritz, Bradley K. ; Hoffmann, W. Clint ; Bagley, W. E. ; Kruger, Greg R. ; Czaczyk, Zbigniew ; Henry, Ryan S.Atomization and sprays, 2014, Vol.24 (9), p.747-760 [Periódico revisado por pares]Texto completo disponível |
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2 |
Material Type: Artigo
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Electrical demonstration of thermally stable Ni silicides on Si1-xCx epitaxial layersMACHKAOUTSAN, V ; VERHEYEN, P ; HORIGUCHI, N ; KERNER, C ; HOFFMANN, T ; GRANNEMAN, E ; VANDERVORST, W ; ABSIL, P ; THOMAS, S. G ; BAUER, M ; ZHANG, Y ; KOELLING, S ; FRANQUET, A ; VANORMELINGEN, K ; LOO, R ; KIM, C. S ; LAUWERS, AMicroelectronic engineering, 2010-03, Vol.87 (3), p.306-310 [Periódico revisado por pares]Amsterdam: ElsevierTexto completo disponível |
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3 |
Material Type: Ata de Congresso
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High-mobility Si1−xGex-channel PFETs: Layout dependence and enhanced scalability, demonstrating 90% performance boost at narrow widthsEneman, G ; Yamaguchi, S ; Ortolland, C ; Takeoka, S ; Witters, L ; Chiarella, T ; Favia, P ; Hikavyy, A ; Mitard, J ; Kobayashi, M ; Krom, R ; Bender, H ; Tseng, J ; Wang, W ; Vandervorst, W ; Loo, R ; Absil, P P ; Biesemans, S ; Hoffmann, T2010 Symposium on VLSI Technology, 2010, p.41-42IEEETexto completo disponível |
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4 |
Material Type: Ata de Congresso
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Dopant and carrier profiling in FinFET-based devices with sub-nanometer resolutionMody, J. ; Kambham, A.K. ; Zschatzsch, G. ; Schatzer, P. ; Chiarella, T. ; Collaert, N. ; Witters, L. ; Jurczak, M. ; Horiguchi, N. ; Gilbert, M. ; Eyben, P. ; Kolling, S ; Schulze, A. ; Hoffmann, T-Y. ; Vandervorst, W.2010 Symposium on VLSI Technology, 2010, p.195-196IEEETexto completo disponível |
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5 |
Material Type: Ata de Congresso
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Basic Aspects of the Formation and Activation of Boron Junctions Using Plasma Immersion Ion ImplantationZschatzsch, G ; Vandervorst, W ; Hoffmann, T ; Goossens, J ; Everaert, J-L ; del Agua Borniquel, J I ; Poon, TAIP conference proceedings, 2008, Vol.1066 (1), p.461-464 [Periódico revisado por pares]United StatesSem texto completo |
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6 |
Material Type: Ata de Congresso
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Ion-implantation-based low-cost Hk/MG process for CMOS low-power applicationOrtolland, C ; Sahhaf, S ; Srividya, V ; Degraeve, R ; Saino, K ; Kim, C S ; Gilbert, M ; Kauerauf, T ; Cho, M J ; Dehan, M ; Schram, T ; Togo, M ; Horiguchi, N ; Groeseneken, G ; Biesemans, S ; Absil, P P ; Vandervorst, W ; Gealy, D ; Hoffmann, T2010 Symposium on VLSI Technology, 2010, p.185-186IEEETexto completo disponível |
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7 |
Material Type: Capítulo de Livro
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FinFETs and Their FuturesHoriguchi, N. ; Parvais, B. ; Chiarella, T. ; Collaert, N. ; Veloso, A. ; Rooyackers, R. ; Verheyen, P. ; Witters, L. ; Redolfi, A. ; De Keersgieter, A. ; Brus, S. ; Zschaetzsch, G. ; Ercken, M. ; Altamirano, E. ; Locorotondo, S. ; Demand, M. ; Jurczak, M. ; Vandervorst, W. ; Hoffmann, T. ; Biesemans, S.Semiconductor-On-Insulator Materials for Nanoelectronics Applications, p.141-153 [Periódico revisado por pares]Berlin, Heidelberg: Springer Berlin HeidelbergSem texto completo |
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8 |
Material Type: Ata de Congresso
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A travelling wave electrode Mach-Zehnder 40 Gb/s demultiplexer based on strain compensated GaInAs/AlInAs tunnelling barrier MQW structureMorl, L. ; Bornholdt, C. ; Hoffmann, D. ; Matzen, K. ; Mekonnen, G.G. ; Reier, F.W.Conference Proceedings. 1998 International Conference on Indium Phosphide and Related Materials (Cat. No.98CH36129), 1998, p.403-406IEEETexto completo disponível |
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9 |
Material Type: Ata de Congresso
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Verdet constant and its dispersion in optical glassesWestenberger, Gerhard ; Hoffmann, Hans J ; Jochs, Werner W ; Przybilla, GudrunSPIE 1991Texto completo disponível |
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10 |
Material Type: Ata de Congresso
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Strain compensated GaInAs/AlInAs tunnelling barrier MQW structure for polarisation independent optical switchingReier, F.W. ; Bach, H.-G. ; Bornholdt, C. ; Hoffmann, D. ; Morl, L. ; Weinert, C.M.Conference Proceedings. 1997 International Conference on Indium Phosphide and Related Materials, 1997, p.222-225IEEETexto completo disponível |