Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: magazinearticle
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Beam-shaping optics deliver high-power beamsWANG, Peter YLaser focus world, 2001-12, Vol.37 (12), p.115-118Tulsa, OK: PennwellTexto completo disponível |
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2 |
Material Type: magazinearticle
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Preparation of KTN films on single crystal quartz substratesZHANG, D. M ; LI, Z. H ; ZHANG, M. J ; WANG, X. D ; HUANG, M. T ; YU, B. M ; XU, D. S ; WANG, Y. M WCAAmerican Ceramic Society bulletin, 2001, Vol.80 (2), p.57-61Westerville, OH: American Ceramic SocietyTexto completo disponível |
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3 |
Material Type: magazinearticle
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Corrosion Monitoring of Painted Autobody Test Panels by Electrochemical Impedance SpectroscopyWang, Y-M ; Radovic, DPlating and surface finishing, 1989-02, Vol.76 (2), p.52-58Sem texto completo |
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4 |
Material Type: magazinearticle
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The Properties of Electroless Ni--P and Ni--P--SiCChanggeng, X ; Xinmin, H ; Zonggang, D ; Yanwen, WPlating and surface finishing, 1989-06, Vol.76 (6), p.90-93Sem texto completo |
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5 |
Material Type: magazinearticle
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Positive Bias Instability and Recovery in InGaAs Channel nMOSFETsDeora, S. ; Bersuker, G. ; Loh, W.-Y ; Veksler, D. ; Matthews, K. ; Kim, T. W. ; Lee, R. T. P. ; Hill, R. J. W. ; Kim, D.-H ; Wang, W.-E ; Hobbs, C. ; Kirsch, P. D.IEEE transactions on device and materials reliability, 2013-12, Vol.13 (4), p.507-514 [Periódico revisado por pares]IEEETexto completo disponível |
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6 |
Material Type: magazinearticle
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Preventive maintenance measures for contamination controlLi, S.-N ; Shih, H.-Y ; Wang, K.-S ; Hsieh, K ; Chen, Yin-Yung ; Chen, Y.-Y ; Chou, JSolid state technology, 2005-12, Vol.48 (12), p.53Tulsa: PennWell Publishing CorpTexto completo disponível |
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7 |
Material Type: magazinearticle
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Reliability of pFET EEPROM With 70-Å Tunnel Oxide Manufactured in Generic Logic CMOS ProcessesMa, Y. ; Gilliland, T. ; Wang, B. ; Paulsen, R. ; Pesavento, A. ; Wang, C.-H. ; Nguyen, H. ; Humes, T. ; Diorio, C.IEEE transactions on device and materials reliability, 2004-09, Vol.4 (3), p.353-358 [Periódico revisado por pares]New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)Texto completo disponível |
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8 |
Material Type: magazinearticle
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Solder Joint Reliability Assessment and Pad Size Studies of FO-WLP With Glass SubstrateWang, P. H. ; Lee, Y. C. ; Lee, C. K. ; Chang, H. H. ; Chiang, K. N.IEEE transactions on device and materials reliability, 2021-03, Vol.21 (1), p.96-101 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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9 |
Material Type: magazinearticle
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Reduced critical size on tetragonal to monoclinic transformation of zirconiaCHEN, S. G ; WANG, D. A ; YU, M ; LI, J ; WANG, X ; YIN, YInterceram, 2007-05, Vol.56 (3), p.174-177Freiburg: SchmidSem texto completo |
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10 |
Material Type: magazinearticle
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Reliability of Pb-free preplated leadframe under atmosphere and accelerated aging testPark, J. ; Kim, Y.-H. ; Wang, S.-W. ; Lee, S.-W. ; Jeon, H.IEEE transactions on device and materials reliability, 2006-03, Vol.6 (1), p.33-41 [Periódico revisado por pares]New York: IEEETexto completo disponível |