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1
Beam-shaping optics deliver high-power beams
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Beam-shaping optics deliver high-power beams

WANG, Peter Y

Laser focus world, 2001-12, Vol.37 (12), p.115-118

Tulsa, OK: Pennwell

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2
Preparation of KTN films on single crystal quartz substrates
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Preparation of KTN films on single crystal quartz substrates

ZHANG, D. M ; LI, Z. H ; ZHANG, M. J ; WANG, X. D ; HUANG, M. T ; YU, B. M ; XU, D. S ; WANG, Y. M WCA

American Ceramic Society bulletin, 2001, Vol.80 (2), p.57-61

Westerville, OH: American Ceramic Society

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3
Corrosion Monitoring of Painted Autobody Test Panels by Electrochemical Impedance Spectroscopy
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Corrosion Monitoring of Painted Autobody Test Panels by Electrochemical Impedance Spectroscopy

Wang, Y-M ; Radovic, D

Plating and surface finishing, 1989-02, Vol.76 (2), p.52-58

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4
The Properties of Electroless Ni--P and Ni--P--SiC
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The Properties of Electroless Ni--P and Ni--P--SiC

Changgeng, X ; Xinmin, H ; Zonggang, D ; Yanwen, W

Plating and surface finishing, 1989-06, Vol.76 (6), p.90-93

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5
Positive Bias Instability and Recovery in InGaAs Channel nMOSFETs
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Positive Bias Instability and Recovery in InGaAs Channel nMOSFETs

Deora, S. ; Bersuker, G. ; Loh, W.-Y ; Veksler, D. ; Matthews, K. ; Kim, T. W. ; Lee, R. T. P. ; Hill, R. J. W. ; Kim, D.-H ; Wang, W.-E ; Hobbs, C. ; Kirsch, P. D.

IEEE transactions on device and materials reliability, 2013-12, Vol.13 (4), p.507-514 [Periódico revisado por pares]

IEEE

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6
Preventive maintenance measures for contamination control
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Preventive maintenance measures for contamination control

Li, S.-N ; Shih, H.-Y ; Wang, K.-S ; Hsieh, K ; Chen, Yin-Yung ; Chen, Y.-Y ; Chou, J

Solid state technology, 2005-12, Vol.48 (12), p.53

Tulsa: PennWell Publishing Corp

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7
Reliability of pFET EEPROM With 70-Å Tunnel Oxide Manufactured in Generic Logic CMOS Processes
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Reliability of pFET EEPROM With 70-Å Tunnel Oxide Manufactured in Generic Logic CMOS Processes

Ma, Y. ; Gilliland, T. ; Wang, B. ; Paulsen, R. ; Pesavento, A. ; Wang, C.-H. ; Nguyen, H. ; Humes, T. ; Diorio, C.

IEEE transactions on device and materials reliability, 2004-09, Vol.4 (3), p.353-358 [Periódico revisado por pares]

New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)

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8
Solder Joint Reliability Assessment and Pad Size Studies of FO-WLP With Glass Substrate
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Solder Joint Reliability Assessment and Pad Size Studies of FO-WLP With Glass Substrate

Wang, P. H. ; Lee, Y. C. ; Lee, C. K. ; Chang, H. H. ; Chiang, K. N.

IEEE transactions on device and materials reliability, 2021-03, Vol.21 (1), p.96-101 [Periódico revisado por pares]

New York: IEEE

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9
Reduced critical size on tetragonal to monoclinic transformation of zirconia
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Reduced critical size on tetragonal to monoclinic transformation of zirconia

CHEN, S. G ; WANG, D. A ; YU, M ; LI, J ; WANG, X ; YIN, Y

Interceram, 2007-05, Vol.56 (3), p.174-177

Freiburg: Schmid

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10
Reliability of Pb-free preplated leadframe under atmosphere and accelerated aging test
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Reliability of Pb-free preplated leadframe under atmosphere and accelerated aging test

Park, J. ; Kim, Y.-H. ; Wang, S.-W. ; Lee, S.-W. ; Jeon, H.

IEEE transactions on device and materials reliability, 2006-03, Vol.6 (1), p.33-41 [Periódico revisado por pares]

New York: IEEE

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