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Symposium on Spark Plasma Synthesis and Sintering
Symposium on Spark Plasma Synthesis and Sintering
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Symposium on Spark Plasma Synthesis and Sintering

OHYANAGI, Manshi ; MUNIR, Zuhair A

Journal of materials science, 2008, Vol.43 (19), p.6375-6452 [Periódico revisado por pares]

Heidelberg: Springer

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2
Microstructural development in asymmetric processing of tantalum plate : Microstructures and textures of films and coatings and refractory metals in electronic applications
Microstructural development in asymmetric processing of tantalum plate : Microstructures and textures of films and coatings and refractory metals in electronic applications
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Microstructural development in asymmetric processing of tantalum plate : Microstructures and textures of films and coatings and refractory metals in electronic applications

FIELD, D. P ; YANKE, J. M ; MCGOWAN, E. V ; MICHALUK, C. A

Journal of electronic materials, 2005, Vol.34 (12), p.1521-1525 [Periódico revisado por pares]

New York, NY: Institute of Electrical and Electronics Engineers

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3
Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles : Phase stability, formation and transformation of electronic materials
Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles : Phase stability, formation and transformation of electronic materials
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Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles : Phase stability, formation and transformation of electronic materials

HSIAO, Li-Yin ; KAO, Szu-Tsung ; DUH, Jenq-Gong

Journal of electronic materials, 2006, Vol.35 (1), p.81-88 [Periódico revisado por pares]

New York, NY: Institute of Electrical and Electronics Engineers

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