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Disc-shaped magazine for mounting disc-shaped object e.g. semiconductor silicon wafer, has stacking area delimiting boundary structure that inlcudes leaf spring damping elements which are secured to spring at fixed end
Disc-shaped magazine for mounting disc-shaped object e.g. semiconductor silicon wafer, has stacking area delimiting boundary structure that inlcudes leaf spring damping elements which are secured to spring at fixed end
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Disc-shaped magazine for mounting disc-shaped object e.g. semiconductor silicon wafer, has stacking area delimiting boundary structure that inlcudes leaf spring damping elements which are secured to spring at fixed end

Giesen, Tim ; Fischmann, Christian ; Ehm, Alexander

2012

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  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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