skip to main content
Idioma:
Primo Advanced Search
Primo Advanced Search Query Term
Primo Advanced Search Query Term
Primo Advanced Search Query Term
Primo Advanced Search prefilters
Busca Simples
Resultados 1 2 3 4 5 next page
Mostrar Somente
Refinado por: assunto: Engineering, Electrical & Electronic remover
Result Number Material Type Add to My Shelf Action Record Details and Options
1
Study on Wet Chemical Etching of Flexible Printed Circuit Board with 16-μm Line Pitch
Study on Wet Chemical Etching of Flexible Printed Circuit Board with 16-μm Line Pitch
Material Type:
Artigo 		Adicionar ao Meu Espaço

Study on Wet Chemical Etching of Flexible Printed Circuit Board with 16-μm Line Pitch

Tang, Yinggang ; Li, Hui ; Sheng, Jiazheng ; Sun, Bin ; Wang, Jian ; Zhang, Chupeng ; Zhang, Daode ; Huang, Yicang

Journal of electronic materials, 2023-06, Vol.52 (6), p.4030-4036 [Periódico revisado por pares]

New York: Springer US

Texto completo disponível

Citações Citado por
2
Modified inductively coupled plasma reactive ion etch process for high aspect ratio etching of fused silica, borosilicate and aluminosilicate glass substrates
Modified inductively coupled plasma reactive ion etch process for high aspect ratio etching of fused silica, borosilicate and aluminosilicate glass substrates
Material Type:
Artigo 		Adicionar ao Meu Espaço

Modified inductively coupled plasma reactive ion etch process for high aspect ratio etching of fused silica, borosilicate and aluminosilicate glass substrates

Zhang, Chenchen ; Tadigadapa, Srinivas

Sensors and actuators. A. Physical., 2018-04, Vol.273, p.147-158 [Periódico revisado por pares]

Lausanne: Elsevier B.V

Texto completo disponível

Citações Citado por
3
Fabrication of Novel MEMS Microgrippers by Deep Reactive Ion Etching With Metal Hard Mask
Fabrication of Novel MEMS Microgrippers by Deep Reactive Ion Etching With Metal Hard Mask
Material Type:
Artigo 		Adicionar ao Meu Espaço

Fabrication of Novel MEMS Microgrippers by Deep Reactive Ion Etching With Metal Hard Mask

Bagolini, Alvise ; Ronchin, Sabina ; Bellutti, Pierluigi ; Chiste, Matteo ; Verotti, Matteo ; Belfiore, Nicola Pio

Journal of microelectromechanical systems, 2017-08, Vol.26 (4), p.926-934 [Periódico revisado por pares]

New York: IEEE

Texto completo disponível

Citações Citado por
4
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review
Material Type:
Artigo 		Adicionar ao Meu Espaço

Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review

Hwang, Sunghyun ; Lee, Woosol ; Carr, William N. ; Yoon, Yong-Kyu

IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-11, Vol.13 (11), p.1848-1860 [Periódico revisado por pares]

Piscataway: IEEE

Texto completo disponível

Citações Citado por
5
Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter Process
Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter Process
Material Type:
Artigo 		Adicionar ao Meu Espaço

Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter Process

Tang, Yemin ; Sandoughsaz, Amin ; Owen, Kevin J. ; Najafi, Khalil

Journal of microelectromechanical systems, 2018-08, Vol.27 (4), p.686-697 [Periódico revisado por pares]

New York: IEEE

Texto completo disponível

Citações Citado por
6
In-plane silicon microneedles with open capillary microfluidic networks by deep reactive ion etching and sacrificial layer based sharpening
In-plane silicon microneedles with open capillary microfluidic networks by deep reactive ion etching and sacrificial layer based sharpening
Material Type:
Artigo 		Adicionar ao Meu Espaço

In-plane silicon microneedles with open capillary microfluidic networks by deep reactive ion etching and sacrificial layer based sharpening

Li, Yan ; Zhang, Hang ; Yang, Ruifeng ; Tazrin, Fahima ; Zhu, Chenxu ; Kaddoura, Moufeed ; Blondeel, Eric J.M. ; Cui, Bo

Sensors and actuators. A. Physical., 2019-06, Vol.292, p.149-157 [Periódico revisado por pares]

Lausanne: Elsevier B.V

Texto completo disponível

Citações Citado por
7
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching
Material Type:
Artigo 		Adicionar ao Meu Espaço

Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching

Liu, Xiaolong ; Radfar, Behrad ; Chen, Kexun ; Setala, Olli E. ; Pasanen, Toni P. ; Yli-Koski, Marko ; Savin, Hele ; Vahanissi, Ville

IEEE transactions on semiconductor manufacturing, 2022-08, Vol.35 (3), p.504-510 [Periódico revisado por pares]

New York: IEEE

Texto completo disponível

Citações Citado por
8
Unveiling Unintentional Fluorine Doping in TMDs During the Reactive Ion Etching: Root Cause Analysis, Physical Insights, and Solution
Unveiling Unintentional Fluorine Doping in TMDs During the Reactive Ion Etching: Root Cause Analysis, Physical Insights, and Solution
Material Type:
Artigo 		Adicionar ao Meu Espaço

Unveiling Unintentional Fluorine Doping in TMDs During the Reactive Ion Etching: Root Cause Analysis, Physical Insights, and Solution

Hemanjaneyulu, Kuruva ; Meersha, Adil ; Kumar, Jeevesh ; Shrivastava, Mayank

IEEE transactions on electron devices, 2022-04, Vol.69 (4), p.1956-1963 [Periódico revisado por pares]

New York: IEEE

Texto completo disponível

Citações Citado por
9
Vertical Sandwich Gate-All-Around Field-Effect Transistors With Self-Aligned High-k Metal Gates and Small Effective-Gate-Length Variation
Vertical Sandwich Gate-All-Around Field-Effect Transistors With Self-Aligned High-k Metal Gates and Small Effective-Gate-Length Variation
Material Type:
Artigo 		Adicionar ao Meu Espaço

Vertical Sandwich Gate-All-Around Field-Effect Transistors With Self-Aligned High-k Metal Gates and Small Effective-Gate-Length Variation

Yin, Xiaogen ; Yang, H. ; Xie, L. ; Ai, X. Z. ; Zhang, Y. B. ; Jia, K. P. ; Wu, Z. H. ; Ma, X. L. ; Zhang, Q. Z. ; Mao, S. J. ; Xiang, J. J. ; Zhang, Yongkui ; Gao, J. F. ; He, X. B. ; Bai, G. B. ; Lu, Y. H. ; Zhou, N. ; Kong, Z. Z. ; Zhang, Y. ; Zhao, J. ; Ma, S. S. ; Xuan, Z. H. ; Zhu, Huilong ; Li, Y. Y. ; Li, L. ; Zhang, Q. H. ; Han, J. H. ; Chen, R. L. ; Qu, Y. ; Yang, T. ; Luo, J. ; Li, J. F. ; Yin, H. X. ; Wang, G. L. ; Radamson, H. ; Zhao, C. ; Wang, W. W. ; Ye, T. C. ; Li, J. J. ; Du, A.Y. ; Li, C. ; Zhao, L. H. ; Huang, W. X.

IEEE electron device letters, 2020-01, Vol.41 (1), p.8-11 [Periódico revisado por pares]

IEEE

Texto completo disponível

Citações Citado por
10
Effect of cations on silicon anisotropic etching process in solutions containing TMAH and TMAH with tensioactive compounds
Effect of cations on silicon anisotropic etching process in solutions containing TMAH and TMAH with tensioactive compounds
Material Type:
Artigo 		Adicionar ao Meu Espaço

Effect of cations on silicon anisotropic etching process in solutions containing TMAH and TMAH with tensioactive compounds

Zubel, Irena

Sensors and actuators. A. Physical., 2020-03, Vol.303, p.111829, Article 111829 [Periódico revisado por pares]

Lausanne: Elsevier B.V

Texto completo disponível

Citações Citado por
Resultados 1 2 3 4 5 next page

Personalize Seus Resultados

  1. Editar

Refine Search Results

Expandir Meus Resultados

  1.   

Mostrar Somente

  1. Recursos Online (13.091)
  2. Revistas revisadas por pares (6.861)

Refinar Meus Resultados

Tipo de Recurso 

  1. Artigos  (8.147)
  2. Anais de Congresso  (5.732)
  3. magazinearticle  (128)
  4. Book Chapters  (30)
  5. Livros  (1)
  6. Mais opções open sub menu

Data de Publicação 

De até
Refinar
  1. Antes de1970  (59)
  2. 1970Até1982  (263)
  3. 1983Até1995  (1.582)
  4. 1996Até2009  (7.126)
  5. Após 2009  (5.094)
  6. Mais opções open sub menu

Idioma 

  1. Japonês  (1.510)
  2. Russo  (9)
  3. Chinês  (5)
  4. Norueguês  (1)
  5. Mais opções open sub menu

  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

Buscando em bases de dados remotas. Favor aguardar.