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Refinado por: assunto: Fabrication remover assunto: Silicon remover
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Etching methods for texturing industrial multi-crystalline silicon wafers: A comprehensive review
Etching methods for texturing industrial multi-crystalline silicon wafers: A comprehensive review
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Etching methods for texturing industrial multi-crystalline silicon wafers: A comprehensive review

Sreejith, K.P. ; Sharma, Ashok Kumar ; Basu, Prabir Kanti ; Kottantharayil, Anil

Solar energy materials and solar cells, 2022-05, Vol.238, p.111531, Article 111531 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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2
In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon
In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon
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In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon

Tokel, Onur ; Turnali, Ahmet ; Makey, Ghaith ; Elahi, Parviz ; Çolakoğlu, Tahir ; Ergeçen, Emre ; Yavuz, Özgün ; Hübner, René ; Borra, Mona Zolfaghari ; Pavlov, Ihor ; Bek, Alpan ; Turan, Raşit ; Kesim, Denizhan Koray ; Tozburun, Serhat ; Ilday, Serim ; Ilday, F Ömer

Nature photonics, 2017-10, Vol.11 (10), p.639-645 [Periódico revisado por pares]

England: Nature Publishing Group

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3
On-chip microfluidic production of cell-sized liposomes
On-chip microfluidic production of cell-sized liposomes
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On-chip microfluidic production of cell-sized liposomes

Deshpande, Siddharth ; Dekker, Cees

Nature protocols, 2018-05, Vol.13 (5), p.856-874 [Periódico revisado por pares]

England: Nature Publishing Group

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4
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review
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Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review

Hwang, Sunghyun ; Lee, Woosol ; Carr, William N. ; Yoon, Yong-Kyu

IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-11, Vol.13 (11), p.1848-1860 [Periódico revisado por pares]

Piscataway: IEEE

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5
Fabrication of GeSn Nanowire MOSFETs by Utilizing Highly Selective Etching Techniques
Fabrication of GeSn Nanowire MOSFETs by Utilizing Highly Selective Etching Techniques
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Fabrication of GeSn Nanowire MOSFETs by Utilizing Highly Selective Etching Techniques

Hong, Tzu-Chieh ; Lu, Wen-Hsiang ; Wang, Yeong-Her ; Li, Jiun-Yun ; Lee, Yao-Jen ; Chao, Tien-Sheng

IEEE transactions on electron devices, 2023-04, Vol.70 (4), p.1-6 [Periódico revisado por pares]

New York: IEEE

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6
Fabrication of Black Silicon via Metal-Assisted Chemical Etching—A Review
Fabrication of Black Silicon via Metal-Assisted Chemical Etching—A Review
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Fabrication of Black Silicon via Metal-Assisted Chemical Etching—A Review

Arafat, Mohammad Yasir ; Islam, Mohammad Aminul ; Mahmood, Ahmad Wafi Bin ; Abdullah, Fairuz ; Nur-E-Alam, Mohammad ; Kiong, Tiong Sieh ; Amin, Nowshad

Sustainability, 2021-10, Vol.13 (19), p.10766 [Periódico revisado por pares]

Basel: MDPI AG

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7
Fabrication of inverted pyramid structure for high-efficiency silicon solar cells using metal assisted chemical etching method with CuSO4 etchant
Fabrication of inverted pyramid structure for high-efficiency silicon solar cells using metal assisted chemical etching method with CuSO4 etchant
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Fabrication of inverted pyramid structure for high-efficiency silicon solar cells using metal assisted chemical etching method with CuSO4 etchant

Zhang, Danni ; Jiang, Shuai ; Tao, Ke ; Jia, Rui ; Ge, Huayun ; Li, Xinpu ; Wang, Bolong ; Li, Minghui ; Ji, Zhuoyu ; Gao, Zhibo ; Jin, Zhi

Solar energy materials and solar cells, 2021-09, Vol.230, p.111200, Article 111200 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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8
Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal
Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal
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Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal

Gong, Tianjiao ; Suzuki, Yukio ; Khan, Muhammad Jehanzeb ; Hiller, Karla ; Tanaka, Shuji

Journal of microelectromechanical systems, 2023-08, Vol.32 (4), p.1-9 [Periódico revisado por pares]

New York: IEEE

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9
High-Aspect-Ratio Thin-Film Stiffening Structures Made of Atomic-Layer-Deposited Alumina and Its Application to a Scanning Micromirror
High-Aspect-Ratio Thin-Film Stiffening Structures Made of Atomic-Layer-Deposited Alumina and Its Application to a Scanning Micromirror
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High-Aspect-Ratio Thin-Film Stiffening Structures Made of Atomic-Layer-Deposited Alumina and Its Application to a Scanning Micromirror

Tung, Nguyen Thanh ; Saito, Shuhei ; Sasaki, Takashi ; Greif, Daniel ; Parsons, Maxwell F. ; Holmes, Steve ; Hane, Kazuhiro

Journal of microelectromechanical systems, 2023-08, Vol.32 (4), p.352-361 [Periódico revisado por pares]

New York: IEEE

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10
Broadband omnidirectional anti-reflection property of V-groove textured silicon
Broadband omnidirectional anti-reflection property of V-groove textured silicon
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Broadband omnidirectional anti-reflection property of V-groove textured silicon

Zhao, Yan ; Liu, Yaoping ; Chen, Quansheng ; Chen, Wei ; Wu, Juntao ; Wang, Yan ; Du, Xiaolong

Solar energy, 2019-11, Vol.193, p.132-138 [Periódico revisado por pares]

New York: Elsevier Ltd

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