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Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D IntegrationSuk-Kyu Ryu ; Kuan-Hsun Lu ; Tengfei Jiang ; Jang-Hi Im ; Rui Huang ; Ho, P. S.IEEE transactions on device and materials reliability, 2012-06, Vol.12 (2), p.255-262 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: magazinearticle
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Web 2.0, identitat i identitat digital. La vida, el temps, la mort, la memòriai la identitatBenach, Ernest ; Pueyo, MiquelItem (Barcelona, Spain), 2013 (57)Texto completo disponível |
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Material Type: magazinearticle
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Efectes de l'aplicació de dos condicionadors del sòl sobre la inestabilitat estructural en una experiència de curta duradaCaselles i Magallon, Maria ; Josa i March, RamonQuaderns agraris, 1990Texto completo disponível |
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Material Type: magazinearticle
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UNAPREÐENJE KONCEPTA PODRIJETLA MARKE PUTEM OBRNUTOG UČINKA ZEMLJE PODRIJETLA: SLUČAJ GENERACIJE ZVranešević, Tihomir ; Pušić, Ana ; Mandić, MiroslavEkonomski pregled, 2024-01, Vol.75 (1), p.32Zagreb: Hrvatsko Drustvo EkonomistaTexto completo disponível |
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Material Type: magazinearticle
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Keep Your AI Projects on TrackBojinov, IavorHarvard business review, 2023-11Boston: Harvard Business ReviewTexto completo disponível |
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Material Type: magazinearticle
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Com guardar el món digital dins d’un COFRE (COnservem per al Futur Recursos Electrònics)Pérez Villalba, Karibel ; Serra Aranda, EugèniaItem (Barcelona, Spain), 2012 (56)Texto completo disponível |
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Material Type: magazinearticle
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Keep It Up, On SafariWeir, RobSing out, 2005-03, Vol.49 (1), p.157Sing Out CorporationTexto completo disponível |
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Material Type: magazinearticle
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An Effective Approach of Improving Electrical and Thermo-Mechanical Reliabilities of Through-Silicon ViasWang, Fengjuan ; Yu, NingmeiIEEE transactions on device and materials reliability, 2017-03, Vol.17 (1), p.106-112 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: magazinearticle
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Wet Metallization of High Aspect Ratio TSV Using Electrografted Polymer Insulator to Suppress Residual Stress in SiliconDequivre, Thomas ; Kolhatkar, Gitanjali ; Hadj Youssef, Azza ; Le, Xuan T. ; Brisard, Gessie M. ; Ruediger, Andreas ; Charlebois, Serge A.IEEE transactions on device and materials reliability, 2017-09, Vol.17 (3), p.514-521 [Periódico revisado por pares]IEEETexto completo disponível |
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Material Type: magazinearticle
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L’arxiu d’empresa com a recurs didàctic en l’educació secundària obligatòria (ESO): l’exemple del fons documental de Pinsos Compostos Rosell SA (Picrosa)Fernández Clarés, M. LluïsaItem (Barcelona, Spain), 2017 (62), p.74Barcelona: IGI GlobalTexto completo disponível |