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Prospect of Recording Technologies for Higher Storage Performance
Prospect of Recording Technologies for Higher Storage Performance
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Prospect of Recording Technologies for Higher Storage Performance

Park, Kyoung-Su ; Park, Young-Pil ; Park, No-Cheol

IEEE transactions on magnetics, 2011-03, Vol.47 (3), p.539-545

New York: IEEE

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Influence of Recording Field Direction on Linearity of Transition in Hard Disk Media With Stacked Structure
Influence of Recording Field Direction on Linearity of Transition in Hard Disk Media With Stacked Structure
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Influence of Recording Field Direction on Linearity of Transition in Hard Disk Media With Stacked Structure

Saito, H. ; Tomiyama, N. ; Sugita, R.

IEEE transactions on magnetics, 2015-11, Vol.51 (11), p.1-4

New York: IEEE

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3
Anti-Shock Air Gap Control for SIL-Based Near-Field Recording System
Anti-Shock Air Gap Control for SIL-Based Near-Field Recording System
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Anti-Shock Air Gap Control for SIL-Based Near-Field Recording System

KIM, Jung-Gon ; KIM, Wan-Chin ; HWANG, Hyun-Woo ; SHIN, Won-Ho ; PARK, Kyoung-Su ; PARK, No-Cheol ; YANG, Hyunseok ; PARK, Young-Pil

IEEE transactions on magnetics, 2009-05, Vol.45 (5), p.2244-2247

New York, NY: IEEE

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4
Effect of Air Bearing Surface on Shock Resistance of Optical Head for Solid Immersion Lens Based Near Field Recording System
Effect of Air Bearing Surface on Shock Resistance of Optical Head for Solid Immersion Lens Based Near Field Recording System
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Effect of Air Bearing Surface on Shock Resistance of Optical Head for Solid Immersion Lens Based Near Field Recording System

LEE, Yonghyun ; LEE, Yong-Eun ; KIM, Ki-Hoon ; KIM, Seokhwan ; YANG, Hyunseok ; PARK, Young-Pil ; PARK, Kyoung-Su

IEEE transactions on magnetics, 2009-05, Vol.45 (5), p.2236-2239

New York, NY: IEEE

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5
Improved Air-Gap Control for SIL-Based Near-Field Recording System
Improved Air-Gap Control for SIL-Based Near-Field Recording System
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Improved Air-Gap Control for SIL-Based Near-Field Recording System

KIM, Joong-Gon ; KIM, Tae-Hun ; CHOI, Hyun ; YOON, Yong-Joong ; JEONG, Jun ; PARK, No-Cheol ; YANG, Hyunseok ; PARK, Young-Pil

IEEE transactions on magnetics, 2007-02, Vol.43 (2), p.811-813

New York, NY: IEEE

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6
Opto-Mechatronics Issues in Solid Immersion Lens-Based Near Field Recording
Opto-Mechatronics Issues in Solid Immersion Lens-Based Near Field Recording
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Opto-Mechatronics Issues in Solid Immersion Lens-Based Near Field Recording

PARK, No-Cheol ; CHOI, Hyun ; YOON, Yong-Joong ; PARK, Young-Pil

IEEE transactions on magnetics, 2007-02, Vol.43 (2), p.785-789

New York, NY: IEEE

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7
Simulation of Contaminates Around the Solid Immersion Lens in a Near-Field Optical Recording System
Simulation of Contaminates Around the Solid Immersion Lens in a Near-Field Optical Recording System
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Simulation of Contaminates Around the Solid Immersion Lens in a Near-Field Optical Recording System

Terrell, E. ; Higgs, C.F.

IEEE transactions on magnetics, 2007-03, Vol.43 (3), p.1086-1092, Article 1086

New York, NY: IEEE

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8
Slider Dynamics With Adhesive Force in Near-Field Recording
Slider Dynamics With Adhesive Force in Near-Field Recording
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Slider Dynamics With Adhesive Force in Near-Field Recording

Wang, H.C. ; Huang, M.S. ; Liu, T.S.

IEEE transactions on magnetics, 2007-02, Vol.43 (2), p.796-798

New York, NY: IEEE

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9
Magnetoresistive memory with recording by electric field: Is the weak ferromagnetism necessary?
Magnetoresistive memory with recording by electric field: Is the weak ferromagnetism necessary?
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Magnetoresistive memory with recording by electric field: Is the weak ferromagnetism necessary?

Morosov, A.I. ; Sigov, A.S.

Journal of magnetism and magnetic materials, 2015-06, Vol.383, p.242-245 [Periódico revisado por pares]

Elsevier B.V

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10
Approximate three-dimensional head fields for perpendicular magnetic recording
Approximate three-dimensional head fields for perpendicular magnetic recording
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Approximate three-dimensional head fields for perpendicular magnetic recording

Wilton, D.T. ; McKirdy, D.Mc.A. ; Shute, H.A. ; Miles, J.J. ; Mapps, D.J.

IEEE transactions on magnetics, 2004-01, Vol.40 (1), p.148-156

New York, NY: IEEE

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