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Electrostatic Doping-Based All GNR Tunnel FET: An Energy-Efficient Design for Power Electronics
Electrostatic Doping-Based All GNR Tunnel FET: An Energy-Efficient Design for Power Electronics
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Electrostatic Doping-Based All GNR Tunnel FET: An Energy-Efficient Design for Power Electronics

Zhang, Weixiang ; Ragab, Tarek ; Basaran, Cemal

IEEE transactions on electron devices, 2019-04, Vol.66 (4), p.1971-1978 [Periódico revisado por pares]

New York: IEEE

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2
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
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Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

Basaran, C. ; Yujun Wen

IEEE transactions on advanced packaging, 2006-11, Vol.29 (4), p.666-673

Piscataway, NY: IEEE

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3
Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading
Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading
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Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading

Basaran, C. ; Wen, Y.

IEEE transactions on components and packaging technologies, 2006-12, Vol.29 (4), p.850-855 [Periódico revisado por pares]

New York: IEEE

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4
Numerical simulation of stress evolution during electromigration in IC interconnect lines
Numerical simulation of stress evolution during electromigration in IC interconnect lines
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Numerical simulation of stress evolution during electromigration in IC interconnect lines

Hua Ye ; Basaran, C. ; Hopkins, D.C.

IEEE transactions on components and packaging technologies, 2003-09, Vol.26 (3), p.673-681 [Periódico revisado por pares]

New York: IEEE

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5
Application of MoirÉ Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA Packages
Application of MoirÉ Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA Packages
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Application of MoirÉ Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA Packages

Liu, Heng ; Basaran, C ; Cartwright, A N ; Casey, W

IEEE transactions on components and packaging technologies, 2004-03, Vol.27 (1), p.217-223 [Periódico revisado por pares]

New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)

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6
Damage Mechanics of Low Temperature Electromigration and Thermomigration
Damage Mechanics of Low Temperature Electromigration and Thermomigration
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Damage Mechanics of Low Temperature Electromigration and Thermomigration

Shidong Li ; Abdulhamid, M.F. ; Basaran, C.

IEEE transactions on advanced packaging, 2009-05, Vol.32 (2), p.478-485

New York: IEEE

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7
Thermomigration Versus Electromigration in Microelectronics Solder Joints
Thermomigration Versus Electromigration in Microelectronics Solder Joints
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Thermomigration Versus Electromigration in Microelectronics Solder Joints

Abdulhamid, M.F. ; Basaran, C. ; Yi-Shao Lai

IEEE transactions on advanced packaging, 2009-08, Vol.32 (3), p.627-635

Piscataway, NJ: IEEE

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8
Damage Mechanics of Low Temperature Electromigration and Thermomigration : Packaging for micro/nano-scale systems
Damage Mechanics of Low Temperature Electromigration and Thermomigration : Packaging for micro/nano-scale systems
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Damage Mechanics of Low Temperature Electromigration and Thermomigration : Packaging for micro/nano-scale systems

SHIDONG LI ; ABDULHAMID, Mohd F ; BASARAN, Cemal

IEEE transactions on advanced packaging, 2009, Vol.32 (2), p.478-485

Piscataway, NJ: Institute of Electrical and Electronics Engineers

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9
Finite element simulation of the temperature cycling tests
Finite element simulation of the temperature cycling tests
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Finite element simulation of the temperature cycling tests

Basaran, C. ; Chandaroy, R.

IEEE transactions on components, packaging, and manufacturing technology. Part A, 1997-12, Vol.20 (4), p.530-536

IEEE

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10
Impact of temperature cycle profile on fatigue life of solder joints
Impact of temperature cycle profile on fatigue life of solder joints
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Impact of temperature cycle profile on fatigue life of solder joints

Dishongh, T. ; Basaran, C. ; Cartwright, A.N. ; Ying Zhao ; Heng Liu

IEEE transactions on advanced packaging, 2002-08, Vol.25 (3), p.433-438

Piscataway, NY: IEEE

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