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Refinado por: assunto: Frequency remover assunto: Physical Sciences remover
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An effective coded excitation scheme based on a predistorted FM signal and an optimized digital filter
An effective coded excitation scheme based on a predistorted FM signal and an optimized digital filter
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An effective coded excitation scheme based on a predistorted FM signal and an optimized digital filter

Misaridis, T.X. ; Jensen, J.A.

1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027), 1999, Vol.2, p.1589-1593 vol.2

IEEE

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2
Fast determination of coupling-of-modes parameters based on strip admittance approach
Fast determination of coupling-of-modes parameters based on strip admittance approach
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Fast determination of coupling-of-modes parameters based on strip admittance approach

Hashimoto, K.-Y. ; Koskela, J. ; Salomaa, M. M.

1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027), 1999, Vol.1, p.93-96 vol.1

IEEE

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3
ZnO thin films for high frequency SAW devices
ZnO thin films for high frequency SAW devices
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ZnO thin films for high frequency SAW devices

Ieki, H. ; Kadota, M.

1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027), 1999, Vol.1, p.281-289 vol.1

IEEE

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4
Single crystal transducers for medical imaging applications
Single crystal transducers for medical imaging applications
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Single crystal transducers for medical imaging applications

Gururaja, T.R. ; Panda, R.K. ; Chen, J. ; Beck, H.

1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027), 1999, Vol.2, p.969-972 vol.2

IEEE

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5
Time recompression of dispersive Lamb waves using a time reversal mirror-application to flaw detection in thin plates
Time recompression of dispersive Lamb waves using a time reversal mirror-application to flaw detection in thin plates
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Time recompression of dispersive Lamb waves using a time reversal mirror-application to flaw detection in thin plates

Ing, R.K. ; Fink, M.

1996 IEEE Ultrasonics Symposium. Proceedings, 1996, Vol.1, p.659-663 vol.1

IEEE

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6
Harmonic imaging at high frequencies for IVUS
Harmonic imaging at high frequencies for IVUS
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Harmonic imaging at high frequencies for IVUS

Van der Steen, A.F.W. ; Poulsen, J.K. ; Cherin, E. ; Foster, F.S.

1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027), 1999, Vol.2, p.1537-1540 vol.2

IEEE

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7
Thickness vibrations of piezoelectric plates with dissipation
Thickness vibrations of piezoelectric plates with dissipation
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Thickness vibrations of piezoelectric plates with dissipation

Lee, P.C.Y. ; Liu, N.H. ; Ballato, A.

1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027), 1999, Vol.2, p.869-872 vol.2

IEEE

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8
Novel power circulation methods for a surface acoustic wave motor
Novel power circulation methods for a surface acoustic wave motor
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Novel power circulation methods for a surface acoustic wave motor

Asai, K. ; Kurosawa, M. K. ; Higuchi, T.

1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027), 1999, Vol.1, p.667-670 vol.1

IEEE

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9
Ultrasonic flaw detection using split-spectrum processing combined with adaptive-network-based fuzzy inference system
Ultrasonic flaw detection using split-spectrum processing combined with adaptive-network-based fuzzy inference system
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Ultrasonic flaw detection using split-spectrum processing combined with adaptive-network-based fuzzy inference system

Sun, H. C. ; Saniie, J.

1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027), 1999, Vol.1, p.801-804 vol.1

IEEE

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10
Fabrication of 2-2 piezoelectric composites by interdigital pair bonding
Fabrication of 2-2 piezoelectric composites by interdigital pair bonding
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Fabrication of 2-2 piezoelectric composites by interdigital pair bonding

Liu, R. ; Knapik, D. ; Harasiewicz, K.A. ; Foster, F.S. ; Flanagan, J.G. ; Pavlin, C.J. ; Trope, G.E.

1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027), 1999, Vol.2, p.973-976 vol.2

IEEE

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