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1
Plasma Characterization of Facing Target Sputter System for Carbon Nitride Film Deposition
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Plasma Characterization of Facing Target Sputter System for Carbon Nitride Film Deposition

Lee, Ji-Gong ; Lee, Sung-Pil

Transactions on Electrical and Electronic Materials, 2004, 5(3), , pp.98-103 [Periódico revisado por pares]

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2
Effect of Boron Content and Temperature on Interactions and Electron Transport in BGaN Bulk Ternary Nitride Semiconductors
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Effect of Boron Content and Temperature on Interactions and Electron Transport in BGaN Bulk Ternary Nitride Semiconductors

Bouchefra, Yasmina ; Sari, Nasr-Eddine Chabane

Transactions on electrical and electronic materials, 2017-02, Vol.18 (1), p.7-12 [Periódico revisado por pares]

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3
Melting and Precision Casting of Ti-6Al-4V Alloy by Use of Electron Beam Furnace
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Melting and Precision Casting of Ti-6Al-4V Alloy by Use of Electron Beam Furnace

Ken Ichiro Suzuki ; Siro Watakabe

Metals and materials international, 2003-08, Vol.9 (4), p.359 [Periódico revisado por pares]

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4
Mechanism for Photoinactivation of PSII by Methyl Viologen at Two Temperatures in the Leaves of Rice (Oryza sativa L.)
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Mechanism for Photoinactivation of PSII by Methyl Viologen at Two Temperatures in the Leaves of Rice (Oryza sativa L.)

Kim, Jin-Hong ; Lee, Choon-Hwan

Journal of plant biology = Singmul Hakhoe chi, 2003-03, Vol.46 (1), p.10-16 [Periódico revisado por pares]

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5
Continuous Dynamic Recrystallization of AISI 430 Ferritic Stainless Steel
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Continuous Dynamic Recrystallization of AISI 430 Ferritic Stainless Steel

Sung Il Kim ; Yeon Chul Yoo

Metals and materials international, 2002-02, Vol.8 (1), p.7 [Periódico revisado por pares]

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