skip to main content
Idioma:
Resultados 1 2 3 4 next page
Mostrar Somente
Refinado por: Base de dados/Biblioteca: IngentaConnect Journals remover Base de dados/Biblioteca: ScienceDirect (Online service) remover tipo de recurso: Anais de Congresso remover
Result Number Material Type Add to My Shelf Action Record Details and Options
1
Issues in nuclear waste isolation research
Issues in nuclear waste isolation research
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Issues in nuclear waste isolation research

DELAGE, Pierre ; YU JUN CUI

Engineering geology, 2005, Vol.81 (3) [Periódico revisado por pares]

Amsterdam: Elsevier

Texto completo disponível

Citações Citado por
2
Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology
Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology

LI, C. Y ; ZHANG, D. H ; SU, S. S ; LU, P. W ; HE, X ; JIA, G. J ; CHEN, Zhe ; WU, S. Y ; KUMAR, Rakesh

Thin solid films, 2004, Vol.462-63, p.172-175 [Periódico revisado por pares]

Lausanne: Elsevier Science

Texto completo disponível

Citações Citado por
3
Development and reliability of non-conductive adhesive flip-chip packages
Development and reliability of non-conductive adhesive flip-chip packages
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Development and reliability of non-conductive adhesive flip-chip packages

TEH, L. K ; ANTO, E ; WONG, C. C ; MHAISALKAR, S. G ; WONG, E. H ; TEO, P. S ; CHEN, Z

Thin solid films, 2004, Vol.462-63, p.446-453 [Periódico revisado por pares]

Lausanne: Elsevier Science

Texto completo disponível

Citações Citado por
4
Effect of post-reflow cooling rate on intermetallic compound formation between Sn-3.5 Ag solder and Ni-P under bump metallization
Effect of post-reflow cooling rate on intermetallic compound formation between Sn-3.5 Ag solder and Ni-P under bump metallization
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Effect of post-reflow cooling rate on intermetallic compound formation between Sn-3.5 Ag solder and Ni-P under bump metallization

HE, Min ; CHEN, Zhong ; QI, Guojun ; WONG, C. C ; MHAISALKAR, S. G

Thin solid films, 2004, Vol.462-63, p.363-369 [Periódico revisado por pares]

Lausanne: Elsevier Science

Texto completo disponível

Citações Citado por
5
Impact of barrier metal on electrical performance of Cu/low K (Black Diamond) in 0.13-μm dual damascene interconnection
Impact of barrier metal on electrical performance of Cu/low K (Black Diamond) in 0.13-μm dual damascene interconnection
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Impact of barrier metal on electrical performance of Cu/low K (Black Diamond) in 0.13-μm dual damascene interconnection

LI, H. Y ; LI, C. Y ; SU, Y. J ; TSANG, C. F

Thin solid films, 2004, Vol.462-63, p.245-249 [Periódico revisado por pares]

Lausanne: Elsevier Science

Texto completo disponível

Citações Citado por
6
Copper surface protection with a completely enclosed copper structure for a damascene process
Copper surface protection with a completely enclosed copper structure for a damascene process
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Copper surface protection with a completely enclosed copper structure for a damascene process

WANG, T. C ; HSIEH, T. E ; WANG, Y. L ; WU, Y. L ; LO, K. Y ; LIU, C. W ; CHEN, K. W

Thin solid films, 2004, Vol.447-48, p.542-548 [Periódico revisado por pares]

Lausanne: Elsevier Science

Texto completo disponível

Citações Citado por
7
Alpha radiation sources in low alpha materials and implications for low alpha materials refinement
Alpha radiation sources in low alpha materials and implications for low alpha materials refinement
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Alpha radiation sources in low alpha materials and implications for low alpha materials refinement

CLARK, Brett M ; WEISER, Martin W ; RASIAH, Ignatius J

Thin solid films, 2004, Vol.462-63, p.384-386 [Periódico revisado por pares]

Lausanne: Elsevier Science

Texto completo disponível

Citações Citado por
8
CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications
CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications

CHANG, T. C ; TSAI, T. M ; LIU, P. T ; CHEN, C. W ; YAN, S. T ; AOKI, H ; CHANGE, Y. C ; TSENG, T. Y

Thin solid films, 2004, Vol.447-48, p.524-530 [Periódico revisado por pares]

Lausanne: Elsevier Science

Texto completo disponível

Citações Citado por
9
Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect
Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect

CHEN, K. W ; WANG, Y. L ; LIU, C. P ; YANG, Kevin ; CHANG, L ; LO, K. Y ; LIU, C. W

Thin solid films, 2004, Vol.447-48, p.531-536 [Periódico revisado por pares]

Lausanne: Elsevier Science

Texto completo disponível

Citações Citado por
10
Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects
Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects

NGWAN, V. C ; CHUNXIANG ZHU ; KRISHNAMOORTHY, Ahila

Thin solid films, 2004, Vol.462-63, p.321-324 [Periódico revisado por pares]

Lausanne: Elsevier Science

Texto completo disponível

Citações Citado por
Resultados 1 2 3 4 next page

Personalize Seus Resultados

  1. Editar

Refine Search Results

Expandir Meus Resultados

  1.   

Mostrar Somente

  1. Recursos Online (29)

  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

Buscando em bases de dados remotas. Favor aguardar.