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Refinado por: Base de dados/Biblioteca: Copper Technical Reference Library remover Nome da Publicação: Journal Of Alloys And Compounds remover assunto: Physical Sciences remover
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Pseudobinary eutectics in Cu–Ag–Ge alloy droplets under containerless condition
Pseudobinary eutectics in Cu–Ag–Ge alloy droplets under containerless condition
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Pseudobinary eutectics in Cu–Ag–Ge alloy droplets under containerless condition

Ruan, Y. ; Wang, X.J. ; Lu, X.Y.

Journal of alloys and compounds, 2013-06, Vol.563, p.85-90 [Periódico revisado por pares]

Kidlington: Elsevier B.V

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Investigation on the formation mechanism of irregular dendrite during directional solidification of Al–Cu alloys under a high magnetic field
Investigation on the formation mechanism of irregular dendrite during directional solidification of Al–Cu alloys under a high magnetic field
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Investigation on the formation mechanism of irregular dendrite during directional solidification of Al–Cu alloys under a high magnetic field

Li, Xi ; Li, Qiuyan ; Ren, Zhongming ; Fautrelle, Yves ; Lu, Xionggang ; Gagnoud, Annie ; Zhang, Yudong ; Esling, Claude ; Wang, Hui ; Dai, Yinming ; Wang, Qiuliang

Journal of alloys and compounds, 2013-12, Vol.581, p.769-775 [Periódico revisado por pares]

Kidlington: Elsevier B.V

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3
Single crystal growth, transport, and electronic band structure of YCoGa5
Single crystal growth, transport, and electronic band structure of YCoGa5
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Single crystal growth, transport, and electronic band structure of YCoGa5

Zhu, Xiangde ; Lu, Wenjian ; Ning, Wei ; Qu, Zhe ; Li, Li ; Qi, T.F. ; Cao, Gang ; Petrovic, Cedomir ; Zhang, Yuheng

JOURNAL OF ALLOYS AND COMPOUNDS, 2013-11, Vol.578, p.543-546 [Periódico revisado por pares]

Kidlington: Elsevier B.V

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Coupling effects at Cu(Ni)–SnAgCu–Cu(Ni) sandwich solder joint during isothermal aging
Coupling effects at Cu(Ni)–SnAgCu–Cu(Ni) sandwich solder joint during isothermal aging
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Coupling effects at Cu(Ni)–SnAgCu–Cu(Ni) sandwich solder joint during isothermal aging

Xia, Yanghua ; Xie, Xiaoming ; Lu, Chuanyan ; Chang, Junling

Journal of alloys and compounds, 2006-06, Vol.417 (1), p.143-149 [Periódico revisado por pares]

Lausanne: Elsevier B.V

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