skip to main content
Idioma:
Mostrar Somente
Refinado por: assunto: Tin remover
Result Number Material Type Add to My Shelf Action Record Details and Options
1
Novel integration process and performances analysis of Low STandby Power (LSTP) 3D multi-channel CMOSFET (MCFET) on SOI with metal / high-K gate stack
Novel integration process and performances analysis of Low STandby Power (LSTP) 3D multi-channel CMOSFET (MCFET) on SOI with metal / high-K gate stack
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Novel integration process and performances analysis of Low STandby Power (LSTP) 3D multi-channel CMOSFET (MCFET) on SOI with metal / high-K gate stack

Bernard, E. ; Ernst, T. ; Guillaumot, B. ; Vulliet, N. ; Barral, V. ; Maffini-Alvaro, V. ; Andrieu, F. ; Vizioz, C. ; Campidelli, Y. ; Gautier, P. ; Hartmann, J.M. ; Kies, R. ; Delaye, V. ; Aussenac, F. ; Poiroux, T. ; Coronel, P. ; Souifi, A. ; Skotnicki, T. ; Deleonibus, S.

2008 Symposium on VLSI Technology, 2008, p.16-17

IEEE

Texto completo disponível

Citações Citado por
2
Impact of the gate stack on the electrical performances of 3D multi-channel MOSFET (MCFET) on SOI
Impact of the gate stack on the electrical performances of 3D multi-channel MOSFET (MCFET) on SOI
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Impact of the gate stack on the electrical performances of 3D multi-channel MOSFET (MCFET) on SOI

Bernard, E. ; Toffoli, A. ; Vidal, V. ; Delaye, V. ; Vizioz, C. ; Campidelli, Y. ; Kermarrec, O. ; Hartmann, J.M. ; Borel, S. ; Faynot, O. ; Souifi, A. ; Ernst, T. ; Coronel, P. ; Skotnicki, T. ; Deleonibus, S. ; Guillaumot, B. ; Vulliet, N. ; Garros, X. ; Maffini-Alvaro, V. ; Andrieu, F. ; Barral, V. ; Allain, F.

ESSDERC 2007 - 37th European Solid State Device Research Conference, 2007, p.147-150

IEEE

Texto completo disponível

Citações Citado por
3
3D stacked channels: how series resistances can limit 3D devices performance
3D stacked channels: how series resistances can limit 3D devices performance
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

3D stacked channels: how series resistances can limit 3D devices performance

Bernard, E. ; Ernst, T. ; Guillaumot, B. ; Vulliet, N. ; Maffini-Alvaro, V. ; Andrieu, F. ; LeCarval, G. ; Rivallin, P. ; Vizioz, C. ; Campidelli, Y. ; Kermarrec, O. ; Hartmann, J.M. ; Borel, S. ; Delaye, V. ; Pouydebasque, A. ; Souifi, A. ; Coronel, P. ; Skotnicki, T. ; Deleonibus, S.

2007 IEEE International SOI Conference, 2007, p.93-94 [Periódico revisado por pares]

IEEE

Texto completo disponível

Citações Citado por
4
3D multichannels and stacked nanowires technologies for new design opportunities in nanoelectronics
3D multichannels and stacked nanowires technologies for new design opportunities in nanoelectronics
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

3D multichannels and stacked nanowires technologies for new design opportunities in nanoelectronics

Ernst, T. ; Bernard, E. ; Dupre, C. ; Hubert, A. ; Becu, S. ; Guillaumot, B. ; Rozeau, O. ; Thomas, O. ; Coronel, P. ; Hartmann, J.-M. ; Vizioz, C. ; Vulliet, N. ; Faynot, O. ; Skotnicki, T. ; Deleonibus, S.

2008 IEEE International Conference on Integrated Circuit Design and Technology and Tutorial, 2008, p.265-268

IEEE

Texto completo disponível

Citações Citado por
5
Deep UV Lithography for 0.35μm Design Rules Application to CMOS Technology with Three Metallization Levels
Deep UV Lithography for 0.35μm Design Rules Application to CMOS Technology with Three Metallization Levels
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Deep UV Lithography for 0.35μm Design Rules Application to CMOS Technology with Three Metallization Levels

Vinet, F. ; Buffet, N. ; Heitzmann, M. ; Laurens, M. ; Le Cornec, C. ; Lerme, M. ; Molle, P. ; Morand, Y. ; Mourier, T. ; Ullmann, H. ; Vizioz, C.

ESSDERC '94: 24th European Solid State Device Research Conference, 1994, p.299-302

IEEE

Texto completo disponível

Citações Citado por

Personalize Seus Resultados

  1. Editar

Refine Search Results

Expandir Meus Resultados

  1.   

Mostrar Somente

  1. Revistas revisadas por pares (1)

Data de Publicação 

De até
Refinar

  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

Buscando em bases de dados remotas. Favor aguardar.