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Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics
Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics
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Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics

Patil, N. ; Celaya, J. ; Das, D. ; Goebel, K. ; Pecht, M.

IEEE transactions on reliability, 2009-06, Vol.58 (2), p.271-276 [Periódico revisado por pares]

New York: IEEE

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2
Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging
Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging
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Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging

Ardebili, H. ; Ee Hua Wong ; Pecht, M.

IEEE transactions on components and packaging technologies, 2003-03, Vol.26 (1), p.206-214 [Periódico revisado por pares]

New York: IEEE

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3
A Rapid Life-Prediction Approach for PBGA Solder Joints Under Combined Thermal Cycling and Vibration Loading Conditions
A Rapid Life-Prediction Approach for PBGA Solder Joints Under Combined Thermal Cycling and Vibration Loading Conditions
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A Rapid Life-Prediction Approach for PBGA Solder Joints Under Combined Thermal Cycling and Vibration Loading Conditions

Haiyu Qi ; Osterman, M. ; Pecht, M.

IEEE transactions on components and packaging technologies, 2009-06, Vol.32 (2), p.283-292 [Periódico revisado por pares]

New York: IEEE

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4
Baseline Performance of Notebook Computers Under Various Environmental and Usage Conditions for Prognostics
Baseline Performance of Notebook Computers Under Various Environmental and Usage Conditions for Prognostics
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Baseline Performance of Notebook Computers Under Various Environmental and Usage Conditions for Prognostics

Pecht, M. ; Kumar, S.

IEEE transactions on components and packaging technologies, 2009-09, Vol.32 (3), p.667-676 [Periódico revisado por pares]

New York: IEEE

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5
Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability
Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability
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Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability

Chauhan, P. ; Pecht, M. ; Osterman, M. ; Lee, S.W.R.

IEEE transactions on components and packaging technologies, 2009-09, Vol.32 (3), p.693-700 [Periódico revisado por pares]

New York: IEEE

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6
Design of Experiments for Board-Level Solder Joint Reliability of PBGA Package Under Various Manufacturing and Multiple Environmental Loading Conditions
Design of Experiments for Board-Level Solder Joint Reliability of PBGA Package Under Various Manufacturing and Multiple Environmental Loading Conditions
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Design of Experiments for Board-Level Solder Joint Reliability of PBGA Package Under Various Manufacturing and Multiple Environmental Loading Conditions

Haiyu Qi ; Osterman, M. ; Pecht, M.

IEEE transactions on electronics packaging manufacturing, 2009-01, Vol.32 (1), p.32-40

New York, NY: IEEE

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7
Material failure mechanisms and damage models
Material failure mechanisms and damage models
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Material failure mechanisms and damage models

Dasgupta, A. ; Pecht, M.

IEEE transactions on reliability, 1991-12, Vol.40 (5), p.531-536 [Periódico revisado por pares]

New York, NY: IEEE

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8
Health assessment of cooling fan bearings using wavelet-based filtering
Health assessment of cooling fan bearings using wavelet-based filtering
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Health assessment of cooling fan bearings using wavelet-based filtering

Miao, Qiang ; Tang, Chao ; Liang, Wei ; Pecht, Michael

Sensors (Basel, Switzerland), 2013-01, Vol.13 (1), p.274-291 [Periódico revisado por pares]

Switzerland: MDPI AG

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9
Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications
Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications
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Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications

Haiyu Qi ; Osterman, M. ; Pecht, M.

IEEE transactions on components and packaging technologies, 2007-06, Vol.30 (2), p.242-247 [Periódico revisado por pares]

New York: IEEE

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10
Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
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Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

Sanapala, R. ; Sood, B. ; Das, D. ; Pecht, M.

IEEE transactions on electronics packaging manufacturing, 2009-10, Vol.32 (4), p.272-280

New York, NY: IEEE

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